参数资料
型号: NCP1246AD100R2G
厂商: ON Semiconductor
文件页数: 4/39页
文件大小: 0K
描述: IC CTLR CURR MODE 100KHZ 8SOIC
标准包装: 2,500
系列: *
NCP1246
MAXIMUM RATINGS
Rating
DRV
(pin 5)
V CC
(pin 6)
HV
(pin 8)
V max
R q J ? A
R q J ? C
T JMAX
T STRGMAX
Symbol
Maximum voltage on DRV pin
(Dc ? Current self ? limited if operated within the allowed range) (Note 1)
V CC Power Supply voltage, V CC pin, continuous voltage
Power Supply voltage, V CC pin, continuous voltage (Note 1)
Maximum voltage on HV pin
(Dc ? Current self ? limited if operated within the allowed range)
Maximum voltage on low power pins (except pin 5, pin 6 and pin 8)
(Dc ? Current self ? limited if operated within the allowed range) (Note 1)
Thermal Resistance SOIC ? 7
Junction-to-Air, low conductivity PCB (Note 2)
Junction-to-Air, medium conductivity PCB (Note 3)
Junction-to-Air, high conductivity PCB (Note 4)
Thermal Resistance Junction ? to ? Case
Operating Junction Temperature
Storage Temperature Range
ESD Capability, HBM model (All pins except HV) per JEDEC Standard JESD22,
Method A114E
ESD Capability, Machine Model per JEDEC Standard JESD22, Method A115A
Value
–0.3 to 20
± 1000 (peak)
–0.3 to 28
± 30 (peak)
–0.3 to 500
± 20
–0.3 to 10
± 10 (peak)
162
147
115
73
? 40 to +150
? 60 to +150
> 2000
> 200
Unit
V
mA
V
mA
V
mA
V
mA
° C/W
° C/W
° C
° C
V
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This device contains latch-up protection and exceeds 100 mA per JEDEC Standard JESD78.
2. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 50 mm 2 of 2 oz copper traces and heat spreading area. As specified
for a JEDEC 51-1 conductivity test PCB. Test conditions were under natural convection or zero air flow.
3. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 100 mm 2 of 2 oz copper traces and heat spreading area. As specified
for a JEDEC 51-2 conductivity test PCB. Test conditions were under natural convection or zero air flow.
4. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 650 mm 2 of 2 oz copper traces and heat spreading area. As specified
for a JEDEC 51-3 conductivity test PCB. Test conditions were under natural convection or zero air flow.
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