参数资料
型号: NCP3125ADR2G
厂商: ON Semiconductor
文件页数: 13/22页
文件大小: 0K
描述: IC REG BUCK SYNC ADJ 4A 8SOIC
标准包装: 1
类型: 降压(降压)
输出类型: 可调式
输出数: 1
输出电压: 0.8 V ~ 5 V
输入电压: 4.5 V ~ 13.2 V
PWM 型: 电压模式
频率 - 开关: 350kHz
电流 - 输出: 4A
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
包装: 标准包装
供应商设备封装: 8-SOICN
其它名称: NCP3125ADR2GOSDKR
NCP3125
When calculating the rise time and fall time of the high side
MOSFET it is important to know the charge characteristic
shown in Figure 22.
F SW = Switching frequency
P RR = High side MOSFET reverse recovery losses
Q RR = Reverse recovery charge
V IN = Input voltage
The low ? side MOSFET turns on into small negative
voltages so switching losses are negligible. The low ? side
MOSFET’s power dissipation only consists of conduction
loss due to R DS(on) and body diode loss during the
non ? overlap periods.
Vth
P D_LS + P COND ) P BODY
(eq. 30)
P BODY = Low side MOSFET body diode losses
P COND = Low side MOSFET conduction losses
P D_LS = Low side MOSFET losses
Conduction loss in the low ? side MOSFET is described as
follows:
I G1
I G2
P COND + I RMS_LS
@ R DS(on)_LS
(1 * D) @ 1 ) ra
I RMS_LS + I OUT @
P DS + 1 @ C OSS @ V IN @ F SW
(eq. 28)
Figure 22. MOSFET Switching Characteristics
Q GD Q GD
t RISE + + (eq. 26)
V BST * V TH R HSPU ) R G
I G1 = Output current from the high ? side gate
drive
Q GD = MOSFET gate to drain gate charge
R HSPU = Drive pull up resistance
R G = MOSFET gate resistance
t RISE = MOSFET rise time
V BST = Boost voltage
V TH = MOSFET gate threshold voltage
Q GD Q GD
t FALL + + (eq. 27)
V BST * V TH R HSPD ) R G
I G2 = Output current from the low ? side gate drive
Q GD = MOSFET gate to drain gate charge
R G = MOSFET gate resistance
R HSPD = Drive pull down resistance
t FALL = MOSFET fall time
V BST = Boost voltage
V TH = MOSFET gate threshold voltage
Next, the MOSFET output capacitance losses are caused
by both the high ? side and low ? side MOSFETs, but are
dissipated only in the high ? side MOSFET.
2
2
C OSS = MOSFET output capacitance at 0V
F SW = Switching frequency
P DS = MOSFET drain to source charge losses
V IN = Input voltage
Finally, the loss due to the reverse recovery time of the
body diode in the low ? side MOSFET is shown as follows:
P RR + Q RR @ V IN @ F SW (eq. 29)
2
(eq. 31)
I RMS_LS = RMS current in the low side
R DS(on)_LS = Low ? side MOSFET on resistance
P COND = High side MOSFET conduction losses
2
(eq. 32)
12
D = Duty ratio
I OUT = Load current
I RMS_LS = RMS current in the low side
ra = Ripple current ratio
The body diode losses can be approximated as:
P BODY + V FD @ I OUT @ F SW @ NOL LH ) NOL HL (eq. 33)
F SW = Switching frequency
I OUT = Load current
NOL HL = Dead time between the high ? side
MOSFET turning off and the low ? side
MOSFET turning on, typically 50 ns
NOL LH = Dead time between the low ? side
MOSFET turning off and the high ? side
MOSFET turning on, typically 50 ns
P BODY = Low ? side MOSFET body diode losses
V FD = Body diode forward voltage drop
Control Dissipation
The control portion of the IC power dissipation is
determined by the formula below:
P C + I CC V IN (eq. 34)
I CC = Control circuitry current draw
P C = Control power dissipation
V IN = Input voltage
Once the IC power dissipations are determined, the
designer can calculate the required thermal impedance to
maintain a specified junction temperature at the worst case
http://onsemi.com
13
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