参数资料
型号: NCP3418BMNR2G
厂商: ON Semiconductor
文件页数: 7/8页
文件大小: 0K
描述: IC MOSFET DRIVER DUAL 12V 10-DFN
产品变化通告: Product Discontinuation 01/Oct/2008
标准包装: 3,000
配置: 高端和低端,同步
输入类型: PWM
延迟时间: 30ns
电流 - 峰: 1.5A
配置数: 1
输出数: 2
高端电压 - 最大(自引导启动): 30V
电源电压: 4.6 V ~ 13.2 V
工作温度: 0°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 10-VFDFN 裸露焊盘
供应商设备封装: 10-DFN(3x3)
包装: 带卷 (TR)
NCP3418B
PACKAGE DIMENSIONS
10 PIN DFN
MN SUFFIX
CASE 485C?01
ISSUE A
D
A
NOTES:
B
E
L1
EDGE OF PACKAGE
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. TERMINAL b MAY HAVE MOLD COMPOUND
MATERIAL ALONG SIDE EDGE. MOLD
2X
PIN 1
REFERENCE
0.15 C
DETAIL A
Bottom View
(Optional)
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
6. DETAILS A AND B SHOW OPTIONAL VIEWS
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE.
2X
0.15 C
TOP VIEW
DIM
MILLIMETERS
MIN MAX
A
0.80 1.00
0.10 C
DETAIL B
(A3)
A
A1
A3
b
D
D2
0.00 0.05
0.20 REF
0.18 0.30
3.00 BSC
2.45 2.55
10X
0.08 C
SIDE VIEW
A1
C
SEATING
PLANE
E
E2
e
K
3.00 BSC
1.75 1.85
0.50 BSC
0.19 TYP
L
0.35 0.45
EXPOSED Cu
L1
0.00 0.03
D2
DETAIL A
MOLD CMPD
10X
L
1
e
5
A3
A1
10X
K
E2
DETAIL B
Side View
(Optional)
SOLDERING FOOTPRINT*
10
6
10X
b
2.6016
0.10 C A B
0.05 C NOTE 3
BOTTOM VIEW
2.1746
10X
0.5651
10X
1.8508
3.3048
0.3008
0.5000 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
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