参数资料
型号: NCP367OPMUEOTBG
厂商: ON Semiconductor
文件页数: 3/13页
文件大小: 0K
描述: IC VOLT PROTECTION OCP OVP 8DFN
标准包装: 3,000
应用: 手持/移动设备
输入电压: 1.2 V ~ 28 V
电源电压: 1.2 V ~ 28 V
电流 - 电源: 42µA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-VFDFN 裸露焊盘
供应商设备封装: 8-DFN(2x2.2)
包装: 带卷 (TR)
NCP367
PIN FUNCTION DESCRIPTION
Pin
1
2
3
4
5
6
7
8
9
Name
IN
V BAT
NC
I LIM
EN
GS
FLAG
GND
OUT
Type
POWER
INPUT
OUTPUT
OUTPUT
INPUT
INPUT
OUTPUT
POWER
OUTPUT
Description
Input Voltage Pin. This pin is connected to the power supply: Wall Adapter or USB. A 1 m F low ESR
ceramic capacitor, or larger, must be connected between this pin and GND.
Li ion Battery voltage sense pin. A serial resistor must be placed between this pin and positive pin of
the battery pack.
Not Connected
Current Limit Pin. This pin provides the reference, based on the internal band ? gap voltage reference, to
limit the overcurrent, across internal PMOSFET, from IN to OUT. A 1% tolerance, or better, resistor
shall be used to get the highest accuracy of the Overcurrent Limit.
Enable Mode Pin. The device enters in shutdown mode when this pin is tied to a high level. In this case
the output is disconnected from the input. The state of this pin does not have an impact on the fault
detection of the FLAG pin.
Gain Select Pin. When the GS pin is tied to 0 level, the Overcurrent threshold is defined by Ilimit set-
ting. See logic table. When GS pin is tied to high, the Overcurrent threshold is set to Ilimit/GS
Fault Indication Pin. This pin allows an external system to detect fault condition. The FLAG pin goes
low when input voltage is below UVLO threshold, exceeds OVLO threshold, charge current from wall
adapter to battery exceeds programmed current limit, Li ion Battery voltage (4.3 V) is exceeded or in-
ternal temperature exceeds thermal shutdown limit. Since the FLAG pin is open drain functionality, an
external pull ? up resistor to VBattery must be added (10 k W minimum value).
Ground.
Output Voltage Pin. This pin follows IN pin when “no input fault” is detected. The output is disconnected
from the Vin power supply when voltage, current or thermal fault events are detected. A 1 m F low ESR
ceramic capacitor, or larger, must be connected between this pin and GND.
NOTE:
Pin out provided for concept purpose only and might change in the final product
MAXIMUM RATINGS
Rating
Minimum Voltage (IN to GND)
Minimum Voltage (All others to GND)
Maximum Voltage (IN to GND)
Maximum Voltage (All others to GND)
Maximum DC Current from Vin to Vout (PMOS)
Thermal Resistance, Junction ? to ? Air (without PCB area)
Operating Ambient Temperature Range
Storage Temperature Range
Junction Operating Temperature
ESD Withstand Voltage (IEC 61000 ? 4 ? 2)
Human Body Model (HBM), Model = 2 (Note 1)
Machine Model (MM) Model = B (Note 2)
Latchup
Moisture Sensitivity
Symbol
Vmin in
Vmin
Vmax in
Vmax
Imax
R q JA
T A
T stg
T J
Vesd
LU
MSL
Value
? 0.3
? 0.3
30
7.0
3.4
190
? 40 to +85
? 65 to +150
150
15 Air, 8.0 Contact
2000
200
Class 1
Level 1
Unit
V
V
V
V
A
° C/W
° C
° C
° C
kV
V
V
?
?
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Human Body Model, 100 pF discharged through a 1.5 k W resistor following specification JESD22/A114.
2. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.
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