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参数资料
| 型号： | NCP6334BMTBBTBG |
| 厂商： | ON Semiconductor |
| 文件页数： | 3/14页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC ADJ 2A 8-WDFN |
| 标准包装： | 3,000 |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 0.6 V ~ 5.5 V |
| 输入电压： | 2.3 V ~ 5.5 V |
| PWM 型： | 电压模式 |
| 频率 - 开关： | 3MHz |
| 电流 - 输出： | 2A |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-WFDFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 8-WDFN（2x2） |
NCP6334B, NCP6334C
Vin
Cin
PVIN
8
SW
2
L
1uH
Vo
10uF
Cout
10uF
AVIN
7
UVLO
PWM / PFM
Control
PGND
1
R1
Cfb
Enable
Power Good
Rpg
1M
EN
5
MODE/PG
6
MODE
PG
Logic Control
&
Current Limit
&
Thermal
Shutdown
Error
Amp
Reference
FB
4
AGND
3
R2
Voltage
Figure 2. Functional Block Diagram
MAXIMUM RATINGS
Value
Rating
Input Supply Voltage to GND
Switch Node to GND
EN, PG/MODE to GND
FB to GND
Human Body Model (HBM) ESD Rating are (Note 1)
Machine Model (MM) ESD Rating (Note 1)
Latchup Current (Note 2)
Operating Junction Temperature Range (Note 3)
Operating Ambient Temperature Range
Storage Temperature Range
Thermal Resistance Junction ? to ? Top Case (Note 4)
Thermal Resistance Junction ? to ? Board (Note 4)
Thermal Resistance Junction ? to ? Ambient (Note 4)
Power Dissipation (Note 5)
Moisture Sensitivity Level (Note 6)
Symbol
V PVIN , V AVIN
V SW
V EN , V PG
V FB
ESD HBM
ESD MM
I LU
T J
T A
T STG
R q JC
R q JB
R q JA
P D
MSL
Min
? 0.3
? 0.3
? 0.3
? 0.3
? 100
? 40
? 40
? 55
12
30
62
1.6
1
Max
7.0
7.0
7.0
2.5
2000
200
100
125
85
150
Unit
V
V
V
V
V
V
mA
° C
° C
° C
° C/W
° C/W
° C/W
W
?
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ± 2.0 kV per JEDEC standard: JESD22 ? A114.
Machine Model (MM) ± 200 V per JEDEC standard: JESD22 ? A115.
2. Latchup Current per JEDEC standard: JESD78 Class II.
3. The thermal shutdown set to 150 ° C (typical) avoids potential irreversible damage on the device due to power dissipation.
4. The thermal resistance values are dependent of the PCB heat dissipation. Board used to drive these data was an 80 x 50 mm NCP6334EVB
board. It is a multilayer board with 1 once internal power and ground planes and 2 ? once copper traces on top and bottom of the board. If
the copper trances of top and bottom are 1 once too, R q JC = 11 ° C/W, R q JB = 30 ° C/W, and R q JA = 72 ° C/W.
5. The maximum power dissipation (PD) is dependent on input voltage, maximum output current and external components selected.
6. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J ? STD ? 020A.
http://onsemi.com
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