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参数资料
| 型号： | NCS36000DRG |
| 厂商： | ON Semiconductor |
| 文件页数： | 2/8页 |
| 文件大小： | 0K |
| 描述： | IC PIR DETECTOR CTLR 14SOIC |
| 标准包装： | 1 |
| 类型： | 检测器控制器 |
| 输入类型： | 数字 |
| 输出类型： | 数字 |
| 接口： | CMOS |
| 电流 - 电源： | 50µA |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 14-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 14-SOICN |
| 包装： | 标准包装 |
| 其它名称： | NCS36000DRGOSDKR |
NCS36000
http://onsemi.com
2
PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
Description
1
OP2_P
Output of second amplifier
2
OP2_N
Inverting input of second amplifier
3
OP1_O
Output of first amplifier
4
OP1_N
Inverting input of first amplifier
5
OP1_P
Noninverting input of first amplifier
6
VREF
Regulated voltage reference to drive sensor
7
VSS
Analog ground reference.
8
OUT
CMOS output (10 mA Max)
9
LED
CMOS output to drive LED (10mA Max)
10
xLED_EN
Active low LED enable input
11
NC
No Connect
12
MODE
Pin used to select pulse count mode
13
OSC
External oscillator to control clock frequency
14
VDD
Analog power supply
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage Range (Note 1)
Vin
0.3 to 6.0
V
Output Voltage Range
Vout
0.3 to 6.0 V or (Vin + 0.3),
whichever is lower
V
Maximum Junction Temperature
TJ(max)
140
°C
Storage Temperature Range
TSTG
65 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2
kV
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Lead Temperature Soldering
Reflow (SMD Styles Only), PbFree Versions (Note 3)
TSLD
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AECQ100002 (EIA/JESD22A114)
ESD Machine Model tested per AECQ100003 (EIA/JESD22A115)
Latchup Current Maximum Rating: v150 mA per JEDEC standard: JESD78
3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Thermal Characteristics, DFN6, 3x3.3 mm (Note 4)
Thermal Resistance, JunctiontoAir (Note 5)
Thermal Reference, JunctiontoLead2 (Note 5)
RqJA
RYJL
Will be Completed once
package and power
consumption is finalized
°C/W
Thermal Characteristics, TSOP5 (Note 4)
Thermal Resistance, JunctiontoAir (Note 5)
RqJA
See note above.
°C/W
4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate.
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