参数资料
型号: NCV7702BDWG
厂商: ON Semiconductor
文件页数: 2/9页
文件大小: 0K
描述: IC DRIVER H-BRDG DUAL 1A 24-SOIC
标准包装: 30
类型: 半桥
输入类型: 非反相
输出数: 4
电流 - 峰值输出: 900mA
电源电压: 7 V ~ 16 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 24-SOIC(0.295",7.50mm 宽)
供应商设备封装: 24-SOIC
包装: 管件
其它名称: Q2618176
Q2915317
NCV7702B
STATUS1
OUT1A
VB1
OUT1B
OUT2A
VB2
OUT2B
STATUS2
Bandgap
Overvolt.
Overtemp.
Regulator
VBG
OV
OT
VBG
OV
OT
OC
OC
Overcurrent
Duty Cycle
OC
OC
OV
OT
PGND PGND PGND PGND EN1 IN1A IN1B
CT
AGND
IN2B IN2A EN2 PGND PGND PGND PGND
Figure 1. Block Diagram
MAXIMUM RATINGS
Rating
Power Supply Voltage, VB
Peak Transient Voltage (46 V Load Dump @ VB = 14 V)
Logic Inputs & Status Outputs
Junction Temperature, T J
Storage Temperature Range
Package Thermal Resistance:
Junction-to-Case, R q JC
Junction-to-Ambient, R q JA
Value
-0.5 to 30
60
-0.3 to 7.0
150
-65 to 150
9
55
Unit
V
V
V
° C
° C
° C/W
° C/W
ESD Capability
Human Body Model
2.0
kV
Machine Model
Peak Reflow Soldering Temperature (60 to 150 seconds at 217 ° C) (Note 1)
Moisture Sensitivity Level (MSL)
200
260 peak
3
V
° C
-
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
2
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