参数资料
| 型号： | NCV7702BDWG |
| 厂商： | ON Semiconductor |
| 文件页数： | 9/9页 |
| 文件大小： | 0K |
| 描述： | IC DRIVER H-BRDG DUAL 1A 24-SOIC |
| 标准包装： | 30 |
| 类型： | 半桥 |
| 输入类型： | 非反相 |
| 输出数： | 4 |
| 电流 - 峰值输出： | 900mA |
| 电源电压： | 7 V ~ 16 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 24-SOIC |
| 包装： | 管件 |
| 其它名称： | Q2618176 Q2915317 |
NCV7702B
PACKAGE DIMENSIONS
SO-24L
DW SUFFIX
CASE 751E-04
ISSUE E
-A-
24
13
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
-B-
12X
P
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
0.010 (0.25)
M
B
M
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
1
12
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
24X
D
J
MATERIAL CONDITION.
0.010 (0.25)
M
T A
S
B
S
DIM
MILLIMETERS
MIN MAX
INCHES
MIN MAX
A
15.25 15.54
0.601
0.612
F
B
C
7.40 7.60
2.35 2.65
0.292 0.299
0.093 0.104
R
X 45 _
D
F
G
0.35 0.49
0.41 0.90
1.27 BSC
0.014 0.019
0.016 0.035
0.050 BSC
-T-
SEATING
C
M
J
K
M
P
0.23 0.32
0.13 0.29
0 _ 8 _
10.05 10.55
0.009 0.013
0.005 0.011
0 _ 8 _
0.395 0.415
PLANE
22X
G
K
R
0.25 0.75
0.010 0.029
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NCV7702B/D
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