参数资料
型号: NCV8184PDG
厂商: ON Semiconductor
文件页数: 19/20页
文件大小: 0K
描述: IC REG LDO ADJ 8SOIC-EP
标准包装: 98
稳压器拓扑结构: 正,可调式
输出电压: 可调
输入电压: 4 V ~ 42 V
电压 - 压降(标准): 0.35V @ 60mA
稳压器数量: 1
电流 - 限制(最小): 70mA
工作温度: -40°C ~ 150°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm Width)裸露焊盘
供应商设备封装: 8-SOIC-EP
包装: 管件
NCV8184
PACKAGE DIMENSIONS
E1
A
8
D
5
2X
D
E
0.10 C A-B
EXPOSED
PAD
5
SOIC ? 8 EP
CASE 751AC
ISSUE B
F
8
G
DETAIL A
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS (ANGLES
IN DEGREES).
3. DIMENSION b DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE
0.08 MM TOTAL IN EXCESS OF THE “b”
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
4. DATUMS A AND B TO BE DETERMINED
AT DATUM PLANE H.
2X
MILLIMETERS
0.10 C D
PIN ONE
LOCATION
0.10 C
8X
0.10 C
SEATING
PLANE
C
1 4
e
B
TOP VIEW
SIDE VIEW
A2
2X
0.20 C
8X b
0.25 C A-B D
H
A
GAUGE
PLANE
0.25
A1
4 1
BOTTOM VIEW
L
(L1)
DETAIL A
q
h
A A
END VIEW
c
b1 (b)
c1
SECTION A ? A
DIM
A
A1
A2
b
b1
c
c1
D
E
E1
e
L
L1
F
G
h
q
MIN MAX
1.35 1.75
0.00 0.10
1.35 1.65
0.31 0.51
0.28 0.48
0.17 0.25
0.17 0.23
4.90 BSC
6.00 BSC
3.90 BSC
1.27 BSC
0.40 1.27
1.04 REF
2.24 3.20
1.55 2.51
0.25 0.50
0 _ 8 _
SOLDERING FOOTPRINT*
2.72
0.107
1.52
0.060
Exposed
Pad
7.0
0.275
0.6
2.03
0.08
4.0
0.155
1.270
0.024
0.050
SCALE 6:1
mm
inches
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
19
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