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参数资料
| 型号： | NP70N10KUF-E1-AY |
| 厂商： | Renesas Electronics America |
| 文件页数： | 10/11页 |
| 文件大小： | 0K |
| 描述： | MOSFET N-CH 100V 70A TO-263 |
| 标准包装： | 800 |
| FET 型： | MOSFET N 通道，金属氧化物 |
| FET 特点： | 标准 |
| 漏极至源极电压(Vdss)： | 100V |
| 电流 - 连续漏极(Id) @ 25° C： | 70A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 20 毫欧 @ 35A，10V |
| Id 时的 Vgs(th)（最大）： | 3.3V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 75nC @ 10V |
| 输入电容 (Ciss) @ Vds： | 3750pF @ 25V |
| 功率 - 最大： | 1.8W |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-263-3，D²Pak（2 引线+接片），TO-263AB |
| 供应商设备封装： | TO-263 |
| 包装： | 带卷 (TR) |
NP70N10KUF
<R>
TAPE INFORMATION
There are two types (-E1, -E2) of taping depending on the direction of the device.
Draw-out side
MARKING INFORMATION
NEC
70N10
UF
Pb-free plating marking
Abbreviation of part number
Lot code
Reel side
RECOMMENDED SOLDERING CONDITIONS
The NP70N10KUF should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
sales representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Soldering Method
Infrared reflow
Partial heating
Soldering Conditions
Maximum temperature (Package's surface temperature): 260°C or below
Time at maximum temperature: 10 seconds or less
Time of temperature higher than 220°C: 60 seconds or less
Preheating time at 160 to 180°C: 60 to 120 seconds
Maximum number of reflow processes: 3 times
Maximum chlorine content of rosin flux (percentage mass): 0.2% or less
Maximum temperature (Pin temperature): 350°C or below
Recommended
Condition Symbol
IR60-00-3
P350
Time (per side of the device): 3 seconds or less
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
Caution Do not use different soldering methods together (except for partial heating).
8
Data Sheet D18040EJ2V0DS
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