参数资料
| 型号： | NSD-2101-ASST |
| 厂商： | ams |
| 文件页数： | 5/23页 |
| 文件大小： | 0K |
| 描述： | IC DRIVER MOTOR SQUIGGLE 16-QFN |
| 产品培训模块： | Miniature Motion Control Overview |
| 标准包装： | 1 |
| 系列： | SQUIGGLE® |
| 应用： | 压电电机驱动器 |
| 评估套件： | 可供 |
| 输出数： | 1 |
| 电源电压： | 2.3 V ~ 5.5 V |
| 工作温度： | -30°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-VQFN 裸露焊盘 |
| 供应商设备封装： | 16-QFN（4x4） |
| 包装： | 标准包装 |
| 其它名称： | NSD-2101-ASSTDKR |
NSD-2101
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 5 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Symbol
Parameter
Min
Typ
Max
Units
Comments
Electrical Parameters
V VDD
V VDDP
Voltage at supply pin
Voltage at supply pin for drivers
-0.3
-0.3
7
7
V
V
V VCC
V VSSP
V VSS
V LV
I scr
Voltage at low voltage supply pin
Voltage at VSSP
Voltage at VSS
Voltage at ADR, SDA, SCL, XPD, TM
Input current (latchup immunity)
-0.3
-0.3
0
-0.3
-100
5.0
0.3
0
7
100
V
V
V
V
mA
Internal LV supply (VCC)
GND reference for drivers
GND reference potential
Norm: JESD78
Electrostatic Discharge
ESD
Electrostatic discharge
±1
kV
Norm: MIL 883 E method 3015.
Human body model: R=1.5k ? , C=100pF,
measured and qualified only in QFN16
package.
Continuous Power Dissipation
P tot
Total power dissipation
1
W
R thja
Thermal resistance QFN16 4x4mm
29.7
33
36.3
K/W
Multi-Layer JEDEC board
Temperature Ranges and Storage Conditions
T strg
Storage temperature
-40
150
oC
T body
Package body temperature
Humidity non-condensing
5
260
85
oC
%
Norm: IPC/JEDEC J-STD-020.
The reflow peak soldering temperature
(body temperature) specified is in
accordance with IPC/JEDEC J-STD-020
“Moisture/Reflow Sensitivity Classification
for Non-Hermetic Solid State Surface Mount
Devices”.
The lead finish for Pb-free leaded packages
is “Matte Tin” (100% Sn).
MSL
Moisture Sensitivity Level
WL-CSP
QFN
1
3
Represents a maximum floor life time of unlimited
Represents a maximum floor life time of 168h
Revision 0.6
4 - 22
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