参数资料
型号: NTD20P06LT4G
厂商: ON Semiconductor
文件页数: 1/7页
文件大小: 0K
描述: MOSFET P-CH 60V 15.5A DPAK
产品目录绘图: MOSFET DPAK Pkg
标准包装: 1
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 15.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 150 毫欧 @ 7.5A,5V
Id 时的 Vgs(th)(最大): 2V @ 250µA
闸电荷(Qg) @ Vgs: 26nC @ 5V
输入电容 (Ciss) @ Vds: 1190pF @ 25V
功率 - 最大: 65W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: DPAK-3
包装: 标准包装
产品目录页面: 1558 (CN2011-ZH PDF)
其它名称: NTD20P06LT4GOSDKR
NTD20P06L, NTDV20P06L
Power MOSFET
? 60 V, ? 15.5 A, Single P ? Channel, DPAK
Features
? Withstands High Energy in Avalanche and Commutation Modes
? Low Gate Charge for Fast Switching
? AEC Q101 Qualified ? NTDV20P06L
? These Devices are Pb ? Free and are RoHS Compliant
Applications
? Bridge Circuits
? Power Supplies, Power Motor Controls
? DC ? DC Conversion
V (BR)DSS
? 60 V
http://onsemi.com
R DS(on) TYP
130 m W @ ? 5.0 V
P ? Channel
D
I D MAX
(Note 1)
? 15.5 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Parameter
Drain ? to ? Source Voltage
Symbol
V DSS
Value
? 60
Unit
V
G
Gate ? to ? Source
Voltage
Continuous
Drain Current
(Note 1)
Continuous
Non ? Repetitive t p v 10 ms
Steady State T A = 25 ° C
V GS
V GSM
I D
$ 20
$ 30
? 15.5
V
A
4
S
MARKING DIAGRAMS
4
Drain
Power Dissipa-
tion (Note 1)
Steady State
T A = 25 ° C
P D
65
W
1 2
3
Pulsed Drain t p = 10 m s
Current
Operating Junction and Storage Temperature
Single Pulse Drain ? to ? Source Avalanche
Energy (V DD = 25 V, V GS = 5 V, I PK = 15 A,
L = 2.7 mH, R G = 25 W )
I DM
T J ,
T STG
E AS
$ 50
? 55 to
175
304
A
° C
mJ
DPAK
CASE 369C
STYLE 2
4
1
Gate
2
Drain
4
Drain
3
Source
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T L
260
° C
THERMAL RESISTANCE RATINGS
1
2
3
Parameter
Symbol
Max
Unit
IPAK/DPAK
Junction ? to ? Case (Drain)
Junction ? to ? Ambient – Steady State (Note 1)
Junction ? to ? Ambient – Steady State (Note 2)
R q JC
R q JA
R q JA
2.3
80
110
° C/W
CASE 369D
STYLE 2
20P06L
1 2 3
Gate Drain Source
Device Code
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface ? mounted on FR4 board using 1 in sq. pad size
(Cu area = 1.127 in sq. [1 oz] including traces)
2. Surface ? mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.412 in sq.)
A = Assembly Location
Y = Year
WW = Work Week
G = Pb ? Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
? Semiconductor Components Industries, LLC, 2011
August, 2011 ? Rev. 6
1
Publication Order Number:
NTD20P06L/D
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