参数资料
型号: NTD6414AN-1G
厂商: ON Semiconductor
文件页数: 2/7页
文件大小: 0K
描述: MOSFET N-CH 100V 32A IPAK
产品目录绘图: MOSFET IPAK-3
标准包装: 75
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 100V
电流 - 连续漏极(Id) @ 25° C: 32A
开态Rds(最大)@ Id, Vgs @ 25° C: 37 毫欧 @ 32A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 40nC @ 10V
输入电容 (Ciss) @ Vds: 1450pF @ 25V
功率 - 最大: 100W
安装类型: 通孔
封装/外壳: TO-251-3 短引线,IPak,TO-251AA
供应商设备封装: I-Pak
包装: 管件
其它名称: NTD6414AN-1G-ND
NTD6414AN-1GOS
NTD6414AN, NVD6414AN
ELECTRICAL CHARACTERISTIC S (T J = 25 ° C unless otherwise noted)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain ? to ? Source Breakdown Voltage
Drain ? to ? Source Breakdown Voltage
Temperature Coefficient
V (BR)DSS
V (BR)DSS /T J
V GS = 0 V, I D = 250 m A
100
107
V
mV/ ° C
Zero Gate Voltage Drain Current
I DSS
V GS = 0 V,
V DS = 100 V
T J = 25 ° C
T J = 125 ° C
1.0
100
m A
Gate ? to ? Source Leakage Current
I GSS
V DS = 0 V, V GS = " 20 V
" 100
nA
ON CHARACTERISTICS (Note 3)
Gate Threshold Voltage
Negative Threshold Temperature
Coefficient
V GS(TH)
V GS(TH) /T J
V GS = V DS , I D = 250 m A
2.0
8.3
4.0
V
mV/ ° C
Drain ? to ? Source On ? Resistance
Forward Transconductance
R DS(on)
gFS
V GS = 10 V, I D = 32 A
V GS = 5.0 V, I D = 10 A
30
18
37
m W
S
CHARGES, CAPACITANCES AND GATE RESISTANCE
Input Capacitance
C ISS
1450
pF
Output Capacitance
Reverse Transfer Capacitance
C OSS
C RSS
V GS = 0 V, f = 1.0 MHz, V DS = 25 V
230
95
Total Gate Charge
Threshold Gate Charge
Q G(TOT)
Q G(TH)
40
1.7
nC
Gate ? to ? Source Charge
Gate ? to ? Drain Charge
Q GS
Q GD
V GS = 10 V, V DS = 80 V, I D = 32 A
8.0
20
Plateau Voltage
Gate Resistance
V GP
R G
5.9
1.9
V
W
SWITCHING CHARACTERISTICS (Not e 4)
Turn ? On Delay Time
t d(on)
11
ns
Rise Time
Turn ? Off Delay Time
Fall Time
t r
t d(off)
t f
V GS = 10 V, V DD = 80 V,
I D = 32 A, R G = 6.1 W
52
38
48
DRAIN ? SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
V SD
V GS = 0 V, I S = 32 A
T J = 25 ° C
T J = 125 ° C
0.87
0.76
1.2
V
Reverse Recovery Time
t RR
68
ns
Charge Time
Discharge Time
T a
T b
V GS = 0 V, dI S /dt = 100 A/ m s,
I S = 32 A
51
16
Reverse Recovery Charge
Q RR
195
nC
2. Surface mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [1 oz] including traces).
3. Pulse Test: Pulse Width ≤ 300 m s, Duty Cycle ≤ 2%.
4. Switching characteristics are independent of operating junction temperatures.
http://onsemi.com
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