- 您现在的位置：买卖IC网 > PDF目录18171 > NTHD4401PT1G (ON Semiconductor)MOSFET PWR P-CH DUAL20V CHIPFET PDF资料下载
参数资料
| 型号： | NTHD4401PT1G |
| 厂商： | ON Semiconductor |
| 文件页数： | 5/6页 |
| 文件大小： | 0K |
| 描述： | MOSFET PWR P-CH DUAL20V CHIPFET |
| 产品变化通告： | Product Obsolescence 21/Jan/2010 |
| 标准包装： | 1 |
| FET 型： | 2 个 P 沟道（双） |
| FET 特点： | 逻辑电平门 |
| 漏极至源极电压(Vdss)： | 20V |
| 电流 - 连续漏极(Id) @ 25° C： | 2.1A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 155 毫欧 @ 2.1A，4.5V |
| Id 时的 Vgs(th)（最大）： | 1.2V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 6nC @ 4.5V |
| 输入电容 (Ciss) @ Vds： | 300pF @ 10V |
| 功率 - 最大： | 1.1W |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SMD，扁平引线 |
| 供应商设备封装： | ChipFET? |
| 包装： | 剪切带 (CT) |
| 其它名称： | NTHD4401PT1GOSCT |
NTHD4401P
1.0
D = 0.5
0.2
0.1
0.1
0.05
Normalized to θ JA at 10s.
0.02
Chip
0.0175 Ω
0.0710 Ω
0.2706 Ω
0.5776 Ω
0.7086 Ω
0.01
SINGLE PULSE
0.0154 F
0.0854 F
0.3074 F
1.7891 F
107.55 F
Ambient
0.01
1.0E?03
1.0E?02
1.0E?01
1.0E+00
1.0E+01
1.0E+02
1.0E+03
t, TIME (s)
Figure 12. Thermal Response
SOLDERING FOOTPRINT*
0 .45 7
0.018
2 .03 2
0.08
2 .03 2
0.08
0.63 5
0.025
0 .63 5
0.025
1 .09 2
0.043
0.17 8
0.007
0.45 7
0.018
0.66
0.026
0.711
0.028
SCALE 20:1
mm
inches
0.66
0.026
0.25 4
0.010
SCALE 20:1
mm
inches
Figure 13. Basic
Figure 14. Style 2
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BASIC PAD PATTERNS
The basic pad layout with dimensions is shown in
Figure 13. This is sufficient for low power dissipation
MOSFET applications, but power semiconductor
performance requires a greater copper pad area, particularly
for the drain leads.
The minimum recommended pad pattern shown in
Figure 14 improves the thermal area of the drain
confines of the basic footprint. The drain copper area is
0.0019 sq. in. (or 1.22 sq. mm). This will assist the power
dissipation path away from the device (through the copper
leadframe) and into the board and exterior chassis (if
applicable) for the single device. The addition of a further
copper area and/or the addition of vias to other board layers
will enhance the performance still further.
connections (pins 5, 6, 7, 8) while remaining within the
http://onsemi.com
5
相关PDF资料 |
PDF描述 |
|---|---|
| FVXO-LC73BR-150 | OSC 150 MHZ 3.3V LVDS SMD |
| EF12.2420.3110.01 | MOD PWR ENTRY STD 12A 2PL QC PNL |
| ECW-F4334RHB | CAP FILM 0.33UF 400VDC RADIAL |
| FVXO-LC73BR-155 | OSC 155 MHZ 3.3V LVDS SMD |
| FXO-HC735-176 | OSC 176 MHZ 3.3V HCMOS SMD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| NTHD4401PT3 | 功能描述:MOSFET -20V -3A Dual RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube |
| NTHD4401PT3G | 功能描述:MOSFET -20V -3A Dual P-Channel RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube |
| NTHD4502N | 制造商:ONSEMI 制造商全称:ON Semiconductor 功能描述:Power MOSFET 30 V, 3.9 A, Dual N−Channel ChipFET |
| NTHD4502NT1 | 功能描述:MOSFET 30V 3.9A Dual RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube |
| NTHD4502NT1G | 功能描述:MOSFET 30V 3.9A Dual N-Channel RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube |
发布紧急采购，3分钟左右您将得到回复。