参数资料
型号: NTHD5904NT3G
厂商: ON Semiconductor
文件页数: 1/6页
文件大小: 0K
描述: MOSFET N-CH 20V 2.5A CHIPFET
产品变化通告: Product Obsolescence 06/Oct/2006
标准包装: 10,000
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 2.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 65 毫欧 @ 3.3A,4.5V
Id 时的 Vgs(th)(最大): 1.2V @ 250µA
闸电荷(Qg) @ Vgs: 6nC @ 4.5V
输入电容 (Ciss) @ Vds: 465pF @ 16V
功率 - 最大: 640mW
安装类型: 表面贴装
封装/外壳: 8-SMD,扁平引线
供应商设备封装: ChipFET?
包装: 带卷 (TR)
NTHD5904N
Power MOSFET
20 V, 4.5 A, Dual N?Channel, ChipFET t
Features
? Low R DS(on) and Fast Switching Speed
? Leadless ChipFET Package has 40% Smaller Footprint than TSOP?6.
http://onsemi.com
?
?
Ideal Device for Applications Where Board Space is at a Premium.
ChipFET Package Exhibits Excellent Thermal Capabilities. Ideal for
Applications Where Heat Transfer is Required.
Pb?Free Packages are Available
V (BR)DSS
20 V
R DS(on) TYP
40 m W @ 4.5 V
I D MAX
4.5 A
Applications
? DC?DC Buck or Boost Converters
? Low Side Switching
? Optimized for Battery and Low Side Switching Applications in
Computing and Portable Equipment
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
55 m W @ 2.5 V
N?Channel MOSFET
D 1 , D 2
Parameter
Drain?to?Source Voltage
Symbol
V DSS
Value
20
Unit
V
G 1 , G 2
Gate?to?Source Voltage
Continuous Drain
Current (Note 1)
Steady
State
T A =25 ° C
T A =85 ° C
V GS
I D
± 8.0
3.3
2.4
V
A
S 1 , S 2
t ≤ 5s
T A =25 ° C
4.5
ChipFET
Power Dissipation
(Note 1)
Continuous Drain
Current (Note 2)
Steady
State
Steady
T A =25 ° C
T A =25 ° C
T A =85 ° C
P D
I D
1.13
2.5
1.8
W
A
CASE 1206A
STYLE 2
Power Dissipation
T A =25 ° C
State
(Note 2)
Pulsed Drain Current t p =10 m s
Operating Junction and Storage Temperature
P D
I DM
T J ,
0.64
10
?55 to
W
A
° C
PIN
CONNECTIONS
MARKING
DIAGRAM
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
T STG
I S
T L
150
2.6
260
A
° C
D 1 8
D 1 7
1 S 1
2 G 1
1
2
8
7
(1/8” from case for 10 s)
THERMAL RESISTANCE RATINGS
D 2 6
3 S 2
3
6
Parameter
Symbol
Max
Unit
D 2 5
4 G 2
4
5
Junction?to?Ambient – Steady State (Note 1)
Junction?to?Ambient – t ≤ 5 s (Note 1)
Junction?to?Ambient – Steady State (Note 2)
R q JA
R q JA
R q JA
110
60
195
° C/W
(Top View)
D3 = Specific Device Code
Maximum ratings are those values beyond which device damage can occur.
M = Month Code
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
G
= Pb?Free Package
reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size
(Cu area = 0.214 in sq).
3. ESD Rating Information: Human Body Model (HBM) Class 0.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
? Semiconductor Components Industries, LLC, 2005
November, 2005 ? Rev. 2
1
Publication Order Number:
NTHD5904N/D
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