参数资料
型号: NTHS2101PT1G
厂商: ON SEMICONDUCTOR
元件分类: JFETs
英文描述: −8.0 V, −7.5 A P−Channel ChipFET
中文描述: 5.4 A, 8 V, 0.025 ohm, P-CHANNEL, Si, POWER, MOSFET
封装: LEAD FREE, CASE 1206A-03, CHIPFET-8
文件页数: 5/6页
文件大小: 54K
代理商: NTHS2101PT1G
NTHS2101P
http://onsemi.com
5
PACKAGE DIMENSIONS
ChipFET
CASE 1206A03
ISSUE E
STYLE 1:
PIN 1. DRAIN
2. DRAIN
3. DRAIN
4. GATE
5. SOURCE
6. DRAIN
7. DRAIN
8. DRAIN
B
S
C
D
G
L
A
1
2
3
4
8
7
6
5
M
J
K
1
2
3
4
8
7
6
5
DIM
A
B
C
D
G
J
K
L
M
S
MIN
2.95
1.55
1.00
0.25
MAX
3.10
1.70
1.10
0.35
MIN
0.116
0.061
0.039
0.010
MAX
0.122
0.067
0.043
0.014
INCHES
MILLIMETERS
0.65 BSC
0.10
0.28
0.55 BSC
5 NOM
0.025 BSC
0.004
0.011
0.022 BSC
5 NOM
0.072
0.20
0.42
0.008
0.017
1.80
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MOLD GATE BURRS SHALL NOT EXCEED 0.13 MM
PER SIDE.
4. LEADFRAME TO MOLDED BODY OFFSET IN
HORIZONTAL AND VERTICAL SHALL NOT EXCEED
0.08 MM.
5. DIMENSIONS A AND B EXCLUSIVE OF MOLD GATE
BURRS.
6. NO MOLD FLASH ALLOWED ON THE TOP AND
BOTTOM LEAD SURFACE.
7. 1206A01 AND 1206A02 OBSOLETE. NEW
STANDARD IS 1206A03.
0.05 (0.002)
2.00
0.080
Basic
Style 1
mm
inches
0.178
0.007
2.032
0.08
1.727
0.068
0.66
0.026
0.711
0.028
0.457
0.018
0.457
0.018
2.032
0.08
0.635
0.025
0.66
0.026
0.711
0.028
mm
inches
SCALE 20:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINTS*
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