参数资料
型号: NTLJD3183CZTAG
厂商: ON Semiconductor
文件页数: 1/9页
文件大小: 0K
描述: MOSFET COMPL 20V LOW PRO 6WDFN
产品变化通告: Product Obsolescence 14/Apr/2010
标准包装: 3,000
FET 型: N 和 P 沟道
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 2.6A,2.2A
开态Rds(最大)@ Id, Vgs @ 25° C: 68 毫欧 @ 2A,4.5V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 7nC @ 4.5V
输入电容 (Ciss) @ Vds: 355pF @ 10V
功率 - 最大: 710mW
安装类型: 表面贴装
封装/外壳: 6-WDFN 裸露焊盘
供应商设备封装: 6-WDFN(2x2)
包装: 带卷 (TR)
NTLJD3183CZ
Power MOSFET
20 V/ ? 20 V, 4.7 A/ ? 4.0 A, m Cool t
Complementary, 2x2 mm, WDFN Package
Features
? WDFN 2x2 mm Package with Exposed Drain Pads for Excellent
Thermal Conduction
? Lowest R DS(on) in 2x2 mm Package
? Footprint Same as SC ? 88 Package
? Low Profile (< 0.8 mm) for Easy Fit in Thin Environments
? ESD Protected
? This is a Pb ? Free Device
Applications
? Optimized for Battery and Load Management Applications in
Portable Equipment
? Load Switch
? Level Shift Circuits
? DC ? DC Converters
V (BR)DSS
N ? Channel
20 V
P ? Channel
? 20 V
D2
http://onsemi.com
R DS(on) MAX
68 m W @ 4.5 V
86 m W @ 2.5 V
120 m W @ 1.8 V
100 m W @ ? 4.5 V
144 m W @ ? 2.5 V
200 m W @ ? 1.8 V
D1
I D MAX
4.7 A
4.2 A
3.5 A
? 4.0 A
? 3.3 A
? 2.8 A
MARKING
DIAGRAM
1 JNM G
G
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Parameter Symbol
Drain ? to ? Source Voltage V DSS
Value
20
Unit
V
Pin 1
WDFN6
CASE 506AN
2
3
6
5
4
Gate ? to ? Source Voltage
N ? Channel
Continuous Drain
Current (Note 1)
Steady
State
t ≤ 5s
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
V GS
I D
± 8.0
3.8
2.7
4.7
V
A
JN = Specific Device Code
M = Date Code
G = Pb ? Free Package
(Note: Microdot may be in either location)
P ? Channel
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
N ? Channel
Continuous Drain
Current (Note 2)
P ? Channel
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Steady
State
t ≤ 5s
Steady
State
t ≤ 5s
Steady
State
Steady
State
Steady
State
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
I D
P D
I D
I D
P D
? 3.2
? 2.3
? 4.0
1.5
2.3
2.6
1.9
? 2.2
? 1.6
0.71
A
W
A
A
W
S1
G1
D2
1
2
3
PIN CONNECTIONS
D1
6
5
D2
4
(Top View)
D1
G2
S2
Pulsed Drain Current
N ? Ch
t p = 10 m s
I DM
18
A
ORDERING INFORMATION
P ? Ch
Operating Junction and Storage Temperature
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
T J , T STG
T L
? 16
? 55 to
150
260
° C
° C
Device
NTLJD3183CZTAG
NTLJD3183CZTBG
Package
WDFN6
(Pb ? Free)
WDFN6
Shipping ?
3000/Tape & Reel
3000/Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size
of 30 mm 2 , 2 oz Cu.
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2008
December, 2008 ? Rev. 0
1
Publication Order Number:
NTLJD3183CZ/D
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