参数资料
型号: NTLJS3180PZTAG
厂商: ON Semiconductor
文件页数: 1/6页
文件大小: 0K
描述: MOSFET P-CH 20V 3.5A 6-WDFN
产品变化通告: Product Obsolescence 21/Jan/2010
标准包装: 3,000
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 3.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 38 毫欧 @ 3A,4.5V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 19.5nC @ 4.5V
输入电容 (Ciss) @ Vds: 1100pF @ 16V
功率 - 最大: 700mW
安装类型: 表面贴装
封装/外壳: 6-WDFN 裸露焊盘
供应商设备封装: 6-WDFN(2x2)
包装: 带卷 (TR)
NTLJS3180PZ
Power MOSFET
? 20 V, ? 7.7 A, m Cool t Single P ? Channel,
ESD, 2x2 mm WDFN Package
Features
? WDFN 2x2 mm Package with Exposed Drain Pads for Excellent
Thermal Conduction
? Lowest R DS(on) Solution in 2x2 mm Package
? Footprint Same as SC ? 88 Package
? Low Profile (< 0.8 mm) for Easy Fit in Thin Environments
? ESD Protected
? This is a Pb ? Free Device
Applications
? Optimized for Battery and Load Management Applications in
Portable Equipment
? High Side Load Switch
? Battery Switch
? DC ? DC Converters
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
V (BR)DSS
? 20 V
http://onsemi.com
R DS(on) MAX
38 m W @ ? 4.5 V
50 m W @ ? 2.5 V
75 m W @ ? 1.8 V
200 m W @ ? 1.5 V
S
G
D
P ? CHANNEL MOSFET
I D MAX
? 7.7 A
Steady
State
2 AAM G 5
Parameter
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
Continuous Drain
Current (Note 1)
T A = 25 ° C
T A = 85 ° C
Symbol
V DSS
V GS
I D
Value
? 20
± 8.0
? 5.9
? 4.2
Unit
V
V
A
S
Pin 1
D
WDFN6
CASE 506AP
MARKING
DIAGRAM
1 6
3 G 4
Power Dissipation
(Note 1)
t ≤ 5s
Steady
State
t ≤ 5s
T A = 25 ° C
T A = 25 ° C
P D
? 7.7
1.9
3.3
W
AA = Specific Device Code
M = Date Code
G = Pb ? Free Package
(Note: Microdot may be in either location)
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Steady
State
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
I D
P D
? 3.5
? 2.5
0.7
A
W
D
1
PIN CONNECTIONS
6
D
Pulsed Drain Current t p = 10 m s
Operating Junction and Storage Temperature
Source Current (Body Diode) (Note 2)
I DM
T J , T STG
I S
? 23
? 55 to
150
? 2.8
A
° C
A
D
G
2
3
5
4
D
S
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
T L
260
° C
(Top View)
3000/Tape & Reel
NTLJS3180PZTBG
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size,
(30 mm 2 , 2 oz Cu).
ORDERING INFORMATION
Device Package Shipping ?
NTLJS3180PZTAG WDFN6
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2008
December, 2008 ? Rev. 0
1
Publication Order Number:
NTLJS3180PZ/D
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