参数资料
型号: NTP5412NG
厂商: ON Semiconductor
文件页数: 1/7页
文件大小: 0K
描述: MOSFET N-CH 60V 60A TO-220AB
产品变化通告: Product Obsolescence 07/Jul/2010
标准包装: 50
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 60A
开态Rds(最大)@ Id, Vgs @ 25° C: 14 毫欧 @ 30A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 85nC @ 0V
输入电容 (Ciss) @ Vds: 3220pF @ 25V
功率 - 最大: 125W
安装类型: 通孔
封装/外壳: TO-220-3
供应商设备封装: TO-220AB
包装: 管件
NTB5412N, NTP5412N
Power MOSFET
60 Amps, 60 Volts
N-Channel D 2 PAK, TO-220
Features
? Low R DS(on)
? High Current Capability
? Avalanche Energy Specified
? These are Pb ? Free Devices
Applications
? LED Lighting and LED Backlight Drivers
? DC ? DC Converters
? DC Motor Drivers
? Power Supplies Secondary Side Synchronous Rectification
V (BR)DSS
60 V
http://onsemi.com
R DS(ON) MAX
14 m W @ 10 V
N ? Channel
D
I D MAX
(Note 1)
60 A
MAXIMUM RATINGS (T J = 25 ° C Unless otherwise specified)
Parameter
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage ? Continuous
Gate ? to ? Source Voltage ? Nonrepetitive
(T P < 10 m s)
Symbol
V DSS
V GS
V GS
Value
60
$ 20
$ 30
Unit
V
V
V
G
4
S
Continuous Drain
Current R q JC
(Note 1)
Power Dissipation
R q JC (Note 1)
Steady
State
Steady
State
T C = 25 ° C
T C = 100 ° C
T C = 25 ° C
I D
P D
60
44
125
A
W
TO ? 220AB
1
2
3
D 2 PAK
4
Pulsed Drain Current t p = 10 m s
Operating and Storage Temperature Range
I DM
T J , T stg
155
? 55 to
175
A
° C
1
2
3
CASE 221A
STYLE 5
CASE 418B
STYLE 2
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche
Energy ? Starting T J = 25 ° C
(V DD = 50 V dc , V GS = 10 V dc , I L(pk) = 60 A,
L = 0.1 mH, R G = 25 W )
I S
E AS
60
180
A
mJ
4
Drain
MARKING DIAGRAM
& PIN ASSIGNMENT
4
Drain
Lead Temperature for Soldering
Purposes, 1/8 ″ from Case for 10 Seconds
THERMAL RESISTANCE RATINGS
T L
260
° C
NTP
5412NG
NTB
5412NG
AYWW
1
3
Gate
Source
Parameter Symbol Max Unit
Junction ? to ? Case (Drain) Steady State R q JC 1.2 ° C/W
(Note 1)
R q JA 43.2
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 sq in pad size,
(Cu Area 1.127 sq in [1 oz] including traces).
1
Gate
AYWW
2
Drain
3
Source
G
A
Y
WW
2
Drain
= Pb ? Free Device
= Assembly Location
= Year
= Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
? Semiconductor Components Industries, LLC, 2008
November, 2008 ? Rev. 1
1
Publication Order Number:
NTB5412N/D
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