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| 型号： | NUP1301ML3T1G |
| 厂商： | ON Semiconductor |
| 文件页数： | 1/4页 |
| 文件大小： | 0K |
| 描述： | IC DIODE ARRAY LOCAP ESD SOT-23 |
| 产品变化通告： | Copper Wire Change 19/May/2010 |
| 标准包装： | 1 |
| 电压 - 反向隔离（标准值）： | 70V |
| 电压 - 击穿： | 70V |
| 电极标记： | 2 通道阵列 - 单向 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-236-3，SC-59，SOT-23-3 |
| 供应商设备封装： | SOT-23-3（TO-236） |
| 包装： | 标准包装 |
| 产品目录页面： | 1131 (CN2011-ZH PDF) |
| 其它名称： | NUP1301ML3T1GOSDKR |
NUP1301ML3T1G,
SZNUP1301ML3T1G
Low Capacitance Diode
Array for ESD Protection in
a Single Data Line
NUP1301ML3T1G is a MicroIntegration device designed to
provide protection for sensitive components from possible harmful
electrical transients; for example, ESD (electrostatic discharge).
Features
? Low Capacitance (0.9 pF Maximum)
? Single Package Integration Design
? Provides ESD Protection for JEDEC Standards JESD22
Machine Model = Class C
Human Body Model = Class 3B
? Protection for IEC61000 ? 4 ? 2 (Level 4)
8.0 kV (Contact)
15 kV (Air)
http://onsemi.com
SOT ? 23
CASE 318
STYLE 11
ANODE CATHODE
1 2
3
CATHODE/ANODE
?
?
?
?
?
Ensures Data Line Speed and Integrity
Fewer Components and Less Board Space
Direct the Transient to Either Positive Side or to the Ground
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC ? Q101 Qualified and
PPAP Capable
Pb ? Free Package is Available*
MARKING DIAGRAM
53 M G
G
1
53 = Device Code
Applications
? T1/E1 Secondary IC Protection
? T3/E3 Secondary IC Protection
M = Date Code
G = Pb ? Free Package
(Note: Microdot may be in either location)
?
?
?
?
?
HDSL, IDSL Secondary IC Protection
Video Line Protection
Microcontroller Input Protection
Base Stations
I 2 C Bus Protection
ORDERING INFORMATION
Device Package Shipping ?
NUP1301ML3T1G SOT ? 23 3,000 /
(Pb ? Free) Tape & Reel
SZNUP1301ML3T1G SOT ? 23 3,000 /
(Pb ? Free)
Tape & Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb ? Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
? Semiconductor Components Industries, LLC, 2012
February, 2012 ? Rev. 6
1
Publication Order Number:
NUP1301ML3T1/D
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相关代理商/技术参数 |
参数描述 |
|---|---|
| NUP1301U | 制造商:NXP Semiconductors 功能描述:DIODE ESD 0.6PF SOT323 制造商:NXP Semiconductors 功能描述:DIODE, ESD, 0.6PF, SOT323 制造商:NXP Semiconductors 功能描述:DIODE, ESD, 0.6PF, SOT323; Diode Type:ESD Protection; Power Dissipation Pd:200mW; Clamping Voltage Vc Max:20V; Diode Case Style:SOT-323; No. of Pins:3 ;RoHS Compliant: Yes |
| NUP1301U,115 | 功能描述:ESD 抑制器 0.6 pF RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
| NUP1301U115 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Ultra low capacitance ESD protection array |
| NUP2105L | 制造商:ONSEMI 制造商全称:ON Semiconductor 功能描述:Dual Line CAN Bus Protector |
| NUP2105L_05 | 制造商:ONSEMI 制造商全称:ON Semiconductor 功能描述:Dual Line CAN Bus Protector |
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