参数资料
型号: NVMFS4841NT1G
厂商: ON Semiconductor
文件页数: 1/6页
文件大小: 0K
描述: MOSFET N-CH 30V 89A SO-8FL
标准包装: 1,500
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 16A
开态Rds(最大)@ Id, Vgs @ 25° C: 7 毫欧 @ 30A,10V
Id 时的 Vgs(th)(最大): 2.5V @ 250µA
闸电荷(Qg) @ Vgs: 17nC @ 4.5V
输入电容 (Ciss) @ Vds: 1436pF @ 12V
功率 - 最大: 3.7W
安装类型: 表面贴装
封装/外壳: 8-TDFN 裸露焊盘(5 引线)
供应商设备封装: 6-DFN,8-SO 扁平引线(5x6)
包装: 带卷 (TR)
NVMFS4841N
Power MOSFET
30V, 7 m W , 89A, Single N ? Channel SO8FL
Features
? Small Footprint (5x6 mm) for Compact Design
? Low R DS(on) to Minimize Conduction Losses
? Low Q G and Capacitance to Minimize Driver Losses
? NVMFS4841NWF ? Wettable Flanks Product
? AEC ? Q101 Qualified and PPAP Capable
? These Devices are Pb ? Free and are RoHS Compliant
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
V (BR)DSS
30 V
http://onsemi.com
R DS(ON) MAX
7.0 m W @ 10 V
11.4 m W @ 4.5 V
I D MAX
89 A
Parameter
Symbol
Value
Unit
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
V DSS
V GS
30
" 20
V
V
D (5,6)
Continuous Drain Cur-
rent R Y J ? mb (Notes 1,
2, 3, 4)
Power Dissipation
R Y J ? mb (Notes 1, 2, 3)
Steady
State
T mb = 25 ° C
T mb = 100 ° C
T mb = 25 ° C
T mb = 100 ° C
I D
P D
89
63
112
56
A
W
G (4)
S (1,2,3)
Power Dissipation
T A = 25 ° C
R q JA (Notes 1, 3)
S
Continuous Drain Cur- T A = 25 ° C
rent R q JA (Notes 1 &
3, 4) Steady T A = 100 ° C
State
T A = 100 ° C
Pulsed Drain Current    T A = 25 ° C, t p = 10 m s
Current limited by package T A = 25 ° C
(Note 4)
Operating Junction and Storage Temperature
I D
P D
I DM
I DmaxPkg
T J , T stg
16
11
3.7
1.8
336
80
? 55 to
175
A
W
A
A
° C
1
N ? CHANNEL MOSFET
MARKING
DIAGRAM
D
DFN5 S XXXXXX
(SO ? 8FL) S AYWZZ
CASE 488AA G
STYLE 1 D
D
D
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche
Energy (T J = 25 ° C, V DD = 24 V, V GS = 10 V,
I L(pk) = 19 A, L = 1.0 mH, R G = 25 W )
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
I S
E AS
T L
51
180
260
A
mJ
° C
A
Y
W
ZZ
= Assembly Location
= Year
= Work Week
= Lot Traceability
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
Parameter
Junction ? to ? Mounting Board (top) ? Steady
State (Note 2, 3)
Junction ? to ? Ambient ? Steady State (Note 3)
Symbol
R Y J ? mb
R q JA
Value
1.3
41
Unit
° C/W
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Psi ( Y ) is used as required per JESD51 ? 12 for packages in which
substantially less than 100% of the heat flows to single case surface.
3. Surface ? mounted on FR4 board using a 650 mm 2 , 2 oz. Cu pad.
4. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
? Semiconductor Components Industries, LLC, 2013
May, 2013 ? Rev. 3
1
Publication Order Number:
NVMFS4841N/D
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