参数资料
型号: P08-100HLC-E-G
厂商: 3M
文件页数: 5/32页
文件大小: 0K
描述: CONN HERMAPHROD 100POS .8MM SM
标准包装: 300
系列: P08
连接器类型: 无公形或母形之分,自配接
位置数: 100
间距: 0.031"(0.80mm)
行数: 2
安装类型: 表面贴装
特点: 板导轨,固定焊尾
触点表面涂层:
触点涂层厚度: 8µin(0.20µm)
包装: 管件
配接层叠高度: 11.5mm
板上方高度: 0.329"(8.35mm)
其它名称: 54745216498
JE150310637
3M ? BACKPLANE CONNECTOR SOLUTIONS
PRODUCT
METPAK ? HM CONNECTORS
METPAK ? HSHM
SOCKETS AND HEADERS
ULTRA HARD METRIC
(UHM) CONNECTORS
3M.com/interconnects
FEATURES
? ROHS COMPLIANT VERSION AVAILABLE
? Hard Metric (HM)
? 5- and 8-Row Versions
? Optional Four Integrated 8.25 A
Power Blades for a Total of 33 A
Power; Saves Space and Press-Fit
Operations
? Socket and Header
? Power Options
? Protective Caps
? Coding Keys
? Shielding Options
? ROHS COMPLIANT VERSION AVAILABLE
? Low Crosstalk at High Frequencies
? Optional Four Integrated 8.25 A
Power Blades for a Total of 33 A
Power; Saves Space and Press-Fit
Operations
? 50/100 (Single-Ended/Differential)
Impedance
? Modular/Scalable Format IEC
61076-4-101
? 63 Mated Lines Per Linear Inch
? Press-Fit Headers and Receptacles
? End-To-End Stackable with 5 Row
3M ? Metpak ? CP2, HM, and
HSHM Headers
? High Speed Hard Metric (HSHM)
? 8 GBPS PER SECOND
? Orthogonal Design Capable
? Differential Pairs in Rows or
Columns
? Virtual Coax Capable
? 5- and 8-Row Versions
? Socket and Header
? Power Options
? Protective Caps for Headers
? Coding Keys
? Shielding Options
? Guide Pin Options
? ROHS COMPLIANT
? 7+ Gbps Data Rates When Mated
to Standard IEC 61076-4-101 2 mm
Hard Metric Headers
? Low Crosstalk at High Frequencies
? 50/100 Ω (Single-Ended/Differential)
Impedance
? Press-Fit Receptacles Fully
Compatible With IEC 61076-4-101
? Dual Beam Contact Construction for
High Reliability
? End-To-End Stackable with 5 Row
3M Metpak CP2, HM, UHM
and HSHM Sockets
? Mates With 3M Metpak CP2, HM,
UHM, HSHM Headers and Any Other
cPCI ? Type Headers
MATERIALS
CONTACT
Material: Copper Alloy
INSULATION
Material: High Temperature
Thermoplastic
FLAMMABILITY UL 94V-0
PLATING
Underplating: 50 μ" [ 1.27 μm ] Nickel
Interface: 30 μ" [ 0.76 μm ] Gold or
5 μ" [ 0.13 μm ] Gold over 40 μ"
[ 1.01 μm ] PdNi
CONTACT
Material: Copper Alloy
INSULATION
Material: High Temperature
Thermoplastic
FLAMMABILITY UL 94V-0
PLATING
Underplating: 50 μ" [ 1.27 μm ] Nickel
Interface: 30 μ" [ 0.76 μm ] Gold or
5 μ" [ 0.13 μm ] Gold over 40 μ"
[ 1.01 μm ] PdNi
CONTACT
Material: Copper Alloy
INSULATION
Material: High Temperature
Thermoplastic (LCP)
FLAMMABILITY UL 94V-0
PLATING
Underplating: 50 μ" [ 1.27 μm ] Nickel
Interface: 30 μ" [ 0.76 μm ] Gold
PERFORMANCE
CURRENT RATING: (Fully Loaded):
1 A at 70°C Signal, 8.25 A @ 70°C Power
TEMPERATURE RATING: -55°C to +125°C
CURRENT RATING: (Fully Loaded):
1 A at 70°C Signal, 8.25 A @
70°C Power
TEMPERATURE RATING: -55°C to +125°C
CURRENT RATING: 1 A at 70°C Signal
TEMPERATURE RATING: -55°C to +125°C
5
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