参数资料
型号: P89LPC901FD,112
厂商: NXP Semiconductors
文件页数: 38/53页
文件大小: 0K
描述: IC 80C51 MCU FLASH 1K 8-SOIC
产品培训模块: Migrating from 8/16-Bit MCUs to 32-Bit ARMs
标准包装: 1
系列: LPC900
核心处理器: 8051
芯体尺寸: 8-位
速度: 18MHz
外围设备: 欠压检测/复位,LED,POR,PWM,WDT
输入/输出数: 6
程序存储器容量: 1KB(1K x 8)
程序存储器类型: 闪存
RAM 容量: 128 x 8
电压 - 电源 (Vcc/Vdd): 2.4 V ~ 3.6 V
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
包装: 剪切带 (CT)
配用: 622-1009-ND - BOARD FOR LPC901 8-DIP
622-1008-ND - BOARD FOR LPC9103 10-HVSON
622-1006-ND - SOCKET ADAPTER BOARD
622-1002-ND - USB IN-CIRCUIT PROG LPC9XX
568-1759-ND - EMULATOR DEBUGGER/PROGRMMR LPC9X
其它名称: 568-1994-1
Philips Semiconductors
P89LPC901/902/903
8-bit microcontrollers with two-clock 80C51 core
Product data
Rev. 05 — 17 December 2004
43 of 53
9397 750 14465
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9.
Limiting values
[1]
The following applies to Limiting values:
a) Stresses above those listed under Table 12 may cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any conditions other than those described in Table 13 “DC electrical characteristics”, Table14“AC
b) This product includes circuitry specically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
c) Parameters are valid over operating temperature range unless otherwise specied. All voltages are with respect to VSS unless
otherwise noted.
Table 12:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
Min
Max
Unit
Tamb(bias)
operating bias ambient temperature
55
+125
°C
Tstg
storage temperature range
65
+150
°C
Vxtal
voltage on XTAL1, XTAL2 pin to VSS,
as applicable
-VDD + 0.5
V
Vn
voltage on any other pin to VSS
0.5
+5.5
V
IOH(I/O)
HIGH-level output current per I/O pin
-
8
mA
IOL(I/O)
LOW-level output current per I/O pin
-
20
mA
II/O(tot)(max)
maximum total I/O current
-
120
mA
Ptot(pack)
total power dissipation per package
based on package heat
transfer, not device power
consumption
-
1.5
W
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