参数资料
型号: P89LPC972FN,129
厂商: NXP Semiconductors
文件页数: 55/66页
文件大小: 0K
描述: MCU 80C51 8KB FLASH 20DIP
标准包装: 18
系列: LPC900
核心处理器: 8051
芯体尺寸: 8-位
速度: 18MHz
连通性: I²C,SPI,UART/USART
外围设备: 欠压检测/复位,POR,PWM,WDT
输入/输出数: 18
程序存储器容量: 8KB(8K x 8)
程序存储器类型: 闪存
RAM 容量: 256 x 8
电压 - 电源 (Vcc/Vdd): 2.4 V ~ 5.5 V
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 20-DIP(0.300",7.62mm)
包装: 管件
其它名称: 568-8749-5
P89LPC972FN,129-ND
P89LPC97X
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 3 — 8 June 2010
59 of 66
NXP Semiconductors
P89LPC970/971/972
8-bit microcontroller with accelerated two-clock 80C51 core
12. Package outline
Fig 24. TSSOP20 package outline (SOT360-1)
UNIT
A1
A2
A3
bp
cD (1)
E (2)
(1)
eHE
LLp
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.5
0.2
8
0
o
0.13
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1
MO-153
99-12-27
03-02-19
w M
b p
D
Z
e
0.25
110
20
11
pin 1 index
θ
A
A1
A2
L p
Q
detail X
L
(A )
3
HE
E
c
v M A
X
A
y
0
2.5
5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
A
max.
1.1
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