参数资料
型号: P89LPC972FN,129
厂商: NXP Semiconductors
文件页数: 57/66页
文件大小: 0K
描述: MCU 80C51 8KB FLASH 20DIP
标准包装: 18
系列: LPC900
核心处理器: 8051
芯体尺寸: 8-位
速度: 18MHz
连通性: I²C,SPI,UART/USART
外围设备: 欠压检测/复位,POR,PWM,WDT
输入/输出数: 18
程序存储器容量: 8KB(8K x 8)
程序存储器类型: 闪存
RAM 容量: 256 x 8
电压 - 电源 (Vcc/Vdd): 2.4 V ~ 5.5 V
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 20-DIP(0.300",7.62mm)
包装: 管件
其它名称: 568-8749-5
P89LPC972FN,129-ND
P89LPC97X
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 3 — 8 June 2010
60 of 66
NXP Semiconductors
P89LPC970/971/972
8-bit microcontroller with accelerated two-clock 80C51 core
Fig 25. DIP20 package outline (SOT146-1)
UNIT
A
max.
1
2
b1
cD
E
e
MH
L
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT146-1
99-12-27
03-02-13
A
min.
A
max.
b
Z
max.
w
M E
e 1
1.73
1.30
0.53
0.38
0.36
0.23
26.92
26.54
6.40
6.22
3.60
3.05
0.254
2.54
7.62
8.25
7.80
10.0
8.3
2
4.2
0.51
3.2
0.068
0.051
0.021
0.015
0.014
0.009
1.060
1.045
0.25
0.24
0.14
0.12
0.01
0.1
0.3
0.32
0.31
0.39
0.33
0.078
0.17
0.02
0.13
SC-603
MS-001
MH
c
(e )
1
ME
A
L
seating
plane
A1
w M
b1
e
D
A2
Z
20
1
11
10
b
E
pin 1 index
0
5
10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
(1)
DIP20: plastic dual in-line package; 20 leads (300 mil)
SOT146-1
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