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参数资料
| 型号： | PC33880DWBR2 |
| 厂商： | MOTOROLA INC |
| 元件分类： | 运动控制电子 |
| 英文描述： | BRUSH DC MOTOR CONTROLLER, 2 A, PDSO28 |
| 封装： | PLASTIC, SOIC-28 |
| 文件页数： | 22/24页 |
| 文件大小： | 362K |
| 代理商： | PC33880DWBR2 |
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33880
7
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
VDD
-0.3 to 7.0
VDC
CS, DI, DO, SCLK, IN5, IN6, and EN (Note1)
—
-0.3 to 7.0
VDC
VPWR
-16 to 50
VDC
Drain 1 - 8 (5.0 mA
≤ I
OUT ≤ 0.3 A) (Note2)
—
-18 to 40
VDC
Source 1 - 8 (5.0 mA
≤ I
OUT ≤ 0.3 A) (Note3)
—
-28 to 40
VDC
Output Voltage Clamp Low Side Drive (Note4)
VOC
40 to 55
VDC
Output Voltage Clamp High Side Drive (Note4)
VOC
-15 to -25
VDC
Output Clamp Energy (Note5)
ECLAMP
50
mJ
ESD Voltage
Human Body Model (Note6)
Machine Model (Note7)
VESD1
VESD2
2000
200
V
Storage Temperature
TSTG
-55
° to +150°°C
Operating Case Temperature
TC
-40
° to +125°°C
Operating Junction Temperature
TJ
-40
° to +150°°C
Maximum Junction Temperature
—
-40
° to +150°°C
PD
1.3
W
Thermal Resistance, Junction-to-Ambient Plastic Package 28 SOIC, Case 751F
RθJA
94
°C/W
PD
1.7
W
Thermal Resistance, Junction-to-Ambient, Plastic Package 32SOIC, Case 1324,
Thermal Resistance Junction to thermal ground leads.
R
θJA
R
θJL
70
18
°C/W
Notes:
1.
Exceeding these limits may cause malfunction or permanent damage to the device.
2.
Configured as Low Side Driver with 300 mA load as current limit.
3.
Configured as High Side Driver with 300 mA load as current limit.
4.
With outputs OFF and 10 mA of test current for low side drive, 30 mA test current for high side drive.
5.
Maximum output clamp energy capability at 150
°C junction temperature using single non-repetitive pulse method.
6.
ESD1 testing is performed in accordance with the Human Body Model (CZap = 100 pF, RZap = 1500 ).
7.
ESD2 testing is performed in accordance with the Machine Model (CZap = 200 pF, RZap = 0 ).
8.
Maximum power dissipation with no heat sink used.
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