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参数资料
| 型号： | PCA85176H/Q900/1,5 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 48/59页 |
| 文件大小： | 0K |
| 描述： | IC LCD DRIVER 40SEG 64TQFP |
| 产品培训模块： | I²C Bus Fundamentals |
| 标准包装： | 1 |
| 显示器类型： | LCD |
| 配置： | 40 段 |
| 接口： | I²C |
| 电流 - 电源： | 80µA |
| 电源电压： | 1.8 V ~ 5.5 V |
| 工作温度： | -40°C ~ 95°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 64-TQFP |
| 供应商设备封装： | 64-TQFP（10x10） |
| 包装： | 标准包装 |
| 其它名称： | 568-5108-6 |
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NXP Semiconductors
PCA85176
Automotive LCD driver for low multiplex rates
19. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description” .
19.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
19.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
? Through-hole components
? Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
?
?
?
?
?
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Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
19.3 Wave soldering
Key characteristics in wave soldering are:
? Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
? Solder bath specifications, including temperature and impurities
PCA85176
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 11 July 2013
? NXP B.V. 2013. All rights reserved.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA85176T/Q900/1,1 | 功能描述:LCD 驱动器 40 SGMT 4800Hz RoHS:否 制造商:Maxim Integrated 数位数量:4.5 片段数量:30 最大时钟频率:19 KHz 工作电源电压:3 V to 3.6 V 最大工作温度:+ 85 C 最小工作温度:- 20 C 封装 / 箱体:PDIP-40 封装:Tube |
| PCA85176T/Q900/1,118 | 制造商:NXP Semiconductors 功能描述:Cut Tape |
| PCA85176T-Q900 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Universal LCD driver for low multiplex rates |
| PCA8521 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Infrared remote control transmitter RC5 |
| PCA8521BP | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Infrared remote control transmitter RC5 |
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