- 您现在的位置：买卖IC网 > Datasheet目录349 > PCA8581T/6,118 (NXP Semiconductors)IC EEPROM 1KBIT 100KHZ 8SOIC Datasheet资料下载
参数资料
| 型号： | PCA8581T/6,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 16/20页 |
| 文件大小： | 0K |
| 描述： | IC EEPROM 1KBIT 100KHZ 8SOIC |
| 标准包装： | 2,500 |
| 格式 - 存储器： | EEPROMs - 串行 |
| 存储器类型： | EEPROM |
| 存储容量： | 1K (128 x 8) |
| 速度： | 100kHz |
| 接口： | I²C，2 线串口 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 工作温度： | -25°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SO |
| 包装： | 带卷 (TR) |
| 其它名称： | 935276987118 PCA8581TD-T PCA8581TD-T-ND |
Philips Semiconductors
128 × 8-bit EEPROM with I 2 C-bus
interface
14 SOLDERING
Product speci?cation
PCA8581; PCA8581C
Several techniques exist for reflowing; for example,
14.1
Introduction
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
method. Typical reflow temperatures range from
215 to 250 ° C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 ° C.
situations reflow soldering is often used.
14.3.2
W AVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
? A double-wave (a turbulent wave with high upward
14.2
14.2.1
DIP
S OLDERING BY DIPPING OR BY WAVE
pressure followed by a smooth laminar wave) soldering
technique should be used.
? The longitudinal axis of the package footprint must be
The maximum permissible temperature of the solder is
260 ° C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T stg max ). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
14.2.2 R EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
parallel to the solder flow.
? The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 ° C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 ° C within
6 seconds. Typical dwell time is 4 seconds at 250 ° C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
soldering iron bit is less than 300 ° C it may remain in
14.3.3
R EPAIRING SOLDERED JOINTS
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 ° C, contact may be up to 5 seconds.
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
14.3
14.3.1
SO
R EFLOW SOLDERING
time must be limited to 10 seconds at up to 300 ° C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1997 Apr 02
16
270 and 320 ° C.
相关PDF资料 |
PDF描述 |
|---|---|
| PCA9530D,118 | IC LED DRIVER RGB 8-SOIC |
| PCA9531PW,118 | IC LED DRIVER RGB 16-TSSOP |
| PCA9532D,118 | IC LED DRIVER RGB 24-SOIC |
| PCA9533DP/01,118 | IC LED DRIVER RGB 8-TSSOP |
| PCA9550DP,118 | IC LED DRIVER BLINKER 8-TSSOP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA8581TD | 功能描述:电可擦除可编程只读存储器 电可擦除可编程只读存储器 128X8 W/I2C 100KHZ RoHS:否 制造商:Atmel 存储容量:2 Kbit 组织:256 B x 8 数据保留:100 yr 最大时钟频率:1000 KHz 最大工作电流:6 uA 工作电源电压:1.7 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 |
| PCA8581TD-T | 功能描述:电可擦除可编程只读存储器 128X8 电可擦除可编程只读存储器 I2C BUS SO-8 RoHS:否 制造商:Atmel 存储容量:2 Kbit 组织:256 B x 8 数据保留:100 yr 最大时钟频率:1000 KHz 最大工作电流:6 uA 工作电源电压:1.7 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 |
| PCA8582F-2 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:256 x 8-bit CMOS EEPROMS with I2C-bus interface |
| PCA8582F-2P | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:256 x 8-bit CMOS EEPROMS with I2C-bus interface |
| PCA8582F-2T | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:256 x 8-bit CMOS EEPROMS with I2C-bus interface |
发布紧急采购，3分钟左右您将得到回复。