- 您现在的位置：买卖IC网 > PDF目录3775 > PCA9505DGG,112 (NXP Semiconductors)IC I/O EXPANDER I2C 40B 56TSSOP PDF资料下载
参数资料
| 型号： | PCA9505DGG,112 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 22/34页 |
| 文件大小： | 0K |
| 描述： | IC I/O EXPANDER I2C 40B 56TSSOP |
| 产品培训模块： | I²C Bus Fundamentals |
| 特色产品： | NXP - I2C Interface |
| 标准包装： | 35 |
| 接口： | I²C |
| 输入/输出数： | 40 |
| 中断输出： | 是 |
| 频率 - 时钟： | 400kHz |
| 电源电压： | 2.3 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 56-TFSOP（0.240"，6.10mm 宽） |
| 供应商设备封装： | 56-TSSOP |
| 包装： | 管件 |
| 包括： | POR |
| 产品目录页面： | 824 (CN2011-ZH PDF) |
| 其它名称： | 568-4244-5 935284486112 PCA9505DGG |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页当前第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页
PCA9505_9506
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 3 August 2010
29 of 34
NXP Semiconductors
PCA9505/06
40-bit I2C-bus I/O port with RESET, OE and INT
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 22) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 12 and 13
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 22.
Table 12.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 13.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
相关PDF资料 |
PDF描述 |
|---|---|
| ATTINY13-20MUR | IC MCU AVR 1K FLASH 10MHZ 20MLF |
| 5-530520-1 | CONT.HIGH CURRENT L.P. |
| 5-583875-6 | TWIN LEAF CONTACT |
| ATTINY861A-SUR | MCU AVR 8KB FLASH 20MHZ 20SOIC |
| 5-66067-5 | CONT AMP LEAF L/P 15 AU/100 SN |
相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA9506 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:40-bit I2C-bus I/O port with RESET, OE and INT |
| PCA9506BS | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:40-bit I2C-bus I/O port with RESET, OE and INT |
| PCA9506BS,118 | 功能描述:接口-I/O扩展器 I/O EXPANDER I2C RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9506BS,118-CUT TAPE | 制造商:NXP 功能描述:PCA9506 Series 40-Bit I2C-Bus I/O Port with RESET OE and INT - HVQFN - 56 |
| PCA9506DGG | 功能描述:接口-I/O扩展器 I/O EXPANDER I2C RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
发布紧急采购，3分钟左右您将得到回复。