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参数资料
| 型号： | PCA9551BS,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 22/26页 |
| 文件大小： | 0K |
| 描述： | IC LED DRIVER BLINKER 16-HVQFN |
| 产品培训模块： | LED Controllers I²C Bus Fundamentals |
| 标准包装： | 1 |
| 拓扑： | 开路漏极，PWM |
| 输出数： | 8 |
| 内部驱动器： | 是 |
| 类型 - 主要： | LED 闪烁器 |
| 频率： | 400kHz |
| 电源电压： | 2.3 V ~ 5.5 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-VQFN 裸露焊盘 |
| 供应商设备封装： | 16-HVQFN |
| 包装： | 标准包装 |
| 工作温度： | -40°C ~ 85°C |
| 产品目录页面： | 844 (CN2011-ZH PDF) |
| 配用： | 568-4002-ND - DEMO BOARD I2C 568-3615-ND - DEMO BOARD I2C |
| 其它名称： | 568-3388-6 |
NXP Semiconductors
PCA9551
8-bit I 2 C-bus LED driver with programmable blink rates
? Process issues, such as application of adhesive and ?ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
? Solder bath speci?cations, including temperature and impurities
15.4 Re?ow soldering
Key characteristics in re?ow soldering are:
? Lead-free versus SnPb soldering; note that a lead-free re?ow process usually leads to
higher minimum peak temperatures (see Figure 26 ) than a SnPb process, thus
reducing the process window
? Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
? Re?ow temperature pro?le; this pro?le includes preheat, re?ow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classi?ed in accordance with
Table 14 and 15
Table 14.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package re?ow temperature ( ° C)
Volume (mm 3 )
< 350
≥ 350
< 2.5
≥ 2.5
Table 15.
235
220
Lead-free process (from J-STD-020C)
220
220
Package thickness (mm)
Package re?ow temperature ( ° C)
Volume (mm 3 )
< 350
350 to 2000
> 2000
< 1.6
1.6 to 2.5
> 2.5
260
260
250
260
250
245
260
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during re?ow
soldering, see Figure 26 .
PCA9551_8
? NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
22 of 26
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA9551BSHP | 功能描述:LED照明驱动器 RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| PCA9551BS-T | 功能描述:LED照明驱动器 8-BIT I2C FM OD LED BLK RST RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| PCA9551D | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:8-bit I2C LED driver with programmable blink rates |
| PCA9551D,112 | 功能描述:LED照明驱动器 I2C LED BLINKER 8BIT RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| PCA9551D,118 | 功能描述:LED照明驱动器 8-BIT I2C FM OD LED BLK RST RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
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