参数资料
| 型号： | PCA9574PW,112 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 20/33页 |
| 文件大小： | 0K |
| 描述： | IC I/O EXPANDER I2C 8B 16TSSOP |
| 标准包装： | 96 |
| 接口： | I²C，SM 总线 |
| 输入/输出数： | 8 |
| 中断输出： | 是 |
| 频率 - 时钟： | 400kHz |
| 电源电压： | 1.1 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 16-TSSOP |
| 包装： | 带卷 (TR) |
| 包括： | POR |
| 其它名称： | 935285149112 PCA9574PW PCA9574PW-ND |
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PCA9574
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 25 April 2012
27 of 33
NXP Semiconductors
PCA9574
8-bit I2C-bus and SMBus, level translating, low volage GPIO
16. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
17. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
17.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
17.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
17.3 Wave soldering
Key characteristics in wave soldering are:
相关PDF资料 |
PDF描述 |
|---|---|
| PCA9574PW,118 | IC I/O EXPANDER I2C 8B 16TSSOP |
| 2-964577-2 | MULTIFIT RAHMEN 2P |
| 1-964577-5 | MULTIFIT RAHMEN 5P |
| 1-964576-3 | PCB RAHMEN 13P |
| PCA8574TS,118 | IC I/O EXPANDER I2C 8B 20SSOP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA9574PW-T | 功能描述:转换 - 电压电平 8-BIT I2C-BUS/SMBUS GPIO TRANS RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| PCA9575HF,118 | 功能描述:I2C 接口集成电路 16-BIT I2C-BUS SMBus LW Voltage GPIO RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
| PCA9575HF118 | 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| PCA9575PW1,118 | 功能描述:I2C 接口集成电路 I2C Bus/ SMBus Level Translating 24-Pin RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
| PCA9575PW2,118 | 功能描述:I2C 接口集成电路 I2C Bus/ SMBus Level Translating 28-Pin RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
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