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参数资料
| 型号： | PCF8563TD-T |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | XO, clock |
| 英文描述： | Real-time clock/calendar |
| 中文描述： | 0 TIMER(S), REAL TIME CLOCK, PDSO8 |
| 封装： | 3.90 MM, PLASTIC, SO-8 |
| 文件页数： | 19/32页 |
| 文件大小： | 711K |
| 代理商： | PCF8563TD-T |
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Philips Semiconductors
PCF8563
Real-time clock/calendar
Product specication
16 April 1999
26 of 30
9397 750 04855
Philips Electronics N.V. 1999. All rights reserved.
During placement and before soldering, the package must be xed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250
°C. A mildly-activated ux will eliminate the
need for removal of corrosive residues in most applications.
14.2.3
Manual soldering
Fix the component by rst soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the at part of the lead. Contact time
must be limited to 10 seconds at up to 300
°C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°C.
14.3 Through-hole mount packages
14.3.1
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is 260
°C; solder at this
temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specied maximum storage temperature (Tstg(max)).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
14.3.2
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300
°C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400
°C, contact may be up to 5 seconds.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PCF8563T-F4 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Real-time clock/calendar |
| PCF8563TF4.118 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Real-time clock/calendar |
| PCF8563TS | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Real-time clock/calendar |
| PCF8563TS/4 | 制造商:NXP Semiconductors 功能描述:RTC/Calender,1.8-5.5V,PCF8563TS/4 |
| PCF8563TS/4,118 | 功能描述:实时时钟 ULTRA LOW PWR CLOCK CALENDAR RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
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