参数资料
型号: PCF8576T/1,118
厂商: NXP Semiconductors
文件页数: 34/44页
文件大小: 0K
描述: IC LCD DRV UNVRSL LOW-MUX 56VSOP
产品培训模块: LCD Driver
标准包装: 1
显示器类型: LCD
配置: 8 段,15 段,160 元件
接口: I²C,2 线串口
数字或字符: 10 字符,20 字符,160 元件
电流 - 电源: 180µA
电源电压: 2 V ~ 9 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 56-BSOP(0.435",11.50mm 宽)
供应商设备封装: 56-VSOP
包装: 标准包装
其它名称: 568-8087-6

Philips Semiconductors
Universal LCD driver for low multiplex rates
Product speci?cation
PCF8576
12.1
Chip-on-glass cascadability in single plane
and the backplane output pads. The only bus line that does
In chip-on-glass technology, where driver devices are
bonded directly onto glass of the LCD, it is important that
the devices may be cascaded without the crossing of
conductors, but the paths of conductors can be continued
on the glass under the chip. All of this is facilitated by the
PCF8576 bonding pad layout (see Fig.30). Pads needing
bus interconnection between all PCF8576s of the cascade
are V DD , V SS , V LCD , CLK, SCL, SDA and SYNC. These
lines may be led to the corresponding pads of the next
PCF8576 through the wide opening between V LCD pad
13 BONDING PAD INFORMATION
handbook, full pagewidth
not require a second opening to lead through to the next
PCF8576 is V LCD , being the cascade centre. The placing
of V LCD adjacent to V SS allows the two supplies to be
connected together.
When an external clocking source is to be used, OSC of all
devices should be connected to V DD . The pads OSC,
A0, A1, A2 and SA0 have been placed between
V SS and V DD to facilitate wiring of oscillator, hardware
subaddress and slave address.
34
33
32
31
30
29
28
27
26
25
24
23
22
21
4.12
S18
S19
S20
S21
S22
S23
S24
S25
35
36
37
38
39
40
41
42
x
20
19
18
17
16
15
14
13
S3
S2
S1
S0
BP3
BP1
BP2
BP0
mm
S26
S27
43
44
0
0
y
S28
45
S29
46
PCF8576
S30
S31
47
48
cascade
centre
12
VLCD
11
VSS
S32
S33
49
50
10
9
SA0
A2
51
52
53
54
55
56
1
2
3
4
5
6
7
8
3.07 mm
MBK282
Bonding pad dimensions: 120 × 120 μ m.
Gold bump dimensions: 94 × 94 × 25 μ m.
Fig.30 Bonding pad locations.
2001 Oct 02
34
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