参数资料
型号: PCF8576T/1,118
厂商: NXP Semiconductors
文件页数: 39/44页
文件大小: 0K
描述: IC LCD DRV UNVRSL LOW-MUX 56VSOP
产品培训模块: LCD Driver
标准包装: 1
显示器类型: LCD
配置: 8 段,15 段,160 元件
接口: I²C,2 线串口
数字或字符: 10 字符,20 字符,160 元件
电流 - 电源: 180µA
电源电压: 2 V ~ 9 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 56-BSOP(0.435",11.50mm 宽)
供应商设备封装: 56-VSOP
包装: 标准包装
其它名称: 568-8087-6

Philips Semiconductors
Universal LCD driver for low multiplex rates
Product speci?cation
PCF8576
17 SOLDERING
If wave soldering is used the following conditions must be
17.1
Introduction to soldering surface mount
packages
observed for optimal results:
? Use a double-wave soldering method comprising a
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
turbulent wave with high upward pressure followed by a
smooth laminar wave.
? For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
17.2
Re?ow soldering
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 250 ° C. The top-surface temperature of the
packages should preferable be kept below 220 ° C for
thick/large packages, and below 235 ° C for small/thin
packages.
? For packages with leads on four sides, the footprint must
be placed at a 45 ° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 ° C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
17.4 Manual soldering
17.3
Wave soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
2001 Oct 02
39
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 ° C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 ° C.
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