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参数资料
| 型号： | PCF8576T/1,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 40/44页 |
| 文件大小： | 0K |
| 描述： | IC LCD DRV UNVRSL LOW-MUX 56VSOP |
| 产品培训模块： | LCD Driver |
| 标准包装： | 1 |
| 显示器类型： | LCD |
| 配置： | 8 段，15 段，160 元件 |
| 接口： | I²C，2 线串口 |
| 数字或字符： | 10 字符，20 字符，160 元件 |
| 电流 - 电源： | 180µA |
| 电源电压： | 2 V ~ 9 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 56-BSOP（0.435"，11.50mm 宽） |
| 供应商设备封装： | 56-VSOP |
| 包装： | 标准包装 |
| 其它名称： | 568-8087-6 |
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Philips Semiconductors
Universal LCD driver for low multiplex rates
Product speci?cation
PCF8576
17.5
Suitability of surface mount IC packages for wave and re?ow soldering methods
SOLDERING METHOD
PACKAGE
BGA, HBGA, LFBGA, SQFP, TFBGA
WAVE
not suitable
REFLOW (1)
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
not
suitable (2)
suitable
PLCC (3) , SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not
not
recommended (3)(4)
recommended (5)
suitable
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45 ° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2001 Oct 02
40
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PCF8576T112 | 制造商:NXP Semiconductors 功能描述:LCD DRIVER 40 SEGMENT SMD 8576 |
| PCF8576TD | 功能描述:LCD 驱动器 LCD DVR UNVRSL LOW-MUX RoHS:否 制造商:Maxim Integrated 数位数量:4.5 片段数量:30 最大时钟频率:19 KHz 工作电源电压:3 V to 3.6 V 最大工作温度:+ 85 C 最小工作温度:- 20 C 封装 / 箱体:PDIP-40 封装:Tube |
| PCF8576TD-T | 功能描述:LCD 驱动器 160 SEGMENT LCD SEGMENT DRIVER RoHS:否 制造商:Maxim Integrated 数位数量:4.5 片段数量:30 最大时钟频率:19 KHz 工作电源电压:3 V to 3.6 V 最大工作温度:+ 85 C 最小工作温度:- 20 C 封装 / 箱体:PDIP-40 封装:Tube |
| PCF8576U | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Universal LCD driver for low multiplex rates |
| PCF8576U/10 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Universal LCD driver for low multiplex rates |
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