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| 型号： | PCF8598C-2T/02,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 16/21页 |
| 文件大小： | 0K |
| 描述： | IC EEPROM 8KBIT 100KHZ 8SOIC |
| 标准包装： | 1,000 |
| 格式 - 存储器： | EEPROMs - 串行 |
| 存储器类型： | EEPROM |
| 存储容量： | 8K (1K x 8) |
| 速度： | 100kHz |
| 接口： | I²C，2 线串口 |
| 电源电压： | 2.5 V ~ 6.0 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 8-SO |
| 包装： | 带卷 (TR) |
| 其它名称： | 935182390118 PCF8598C2D-T PCF8598C2D-T-ND |
Philips Semiconductors
PCF8598C-2
1024 × 8-bit CMOS EEPROM with I 2 C-bus interface
15. Soldering
15.1 Introduction
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering is often
preferred when through-hole and surface mount components are mixed on one
printed-circuit board. Wave soldering can still be used for certain surface mount ICs,
but it is not suitable for ?ne pitch SMDs. In these situations re?ow soldering is
recommended. Driven by legislation and environmental forces the worldwide use of
lead-free solder pastes is increasing.
15.2 Through-hole mount packages
15.2.1
15.2.2
Soldering by dipping or by solder wave
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 ° C or
265 ° C, depending on solder material applied, SnPb or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the speci?ed maximum storage temperature (T stg(max) ).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300 ° C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400 ° C, contact may be up to 5 seconds.
15.3 Surface mount packages
9397 750 14219
15.3.1
Re?ow soldering
Re?ow soldering requires solder paste (a suspension of ?ne solder particles, ?ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for re?owing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical re?ow peak temperatures range from 215 to 270 ° C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
? below 225 ° C (SnPb process) or below 245 ° C (Pb-free process)
– for all the BGA and SSOP-T packages
? Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data
Rev. 06 — 22 October 2004
16 of 21
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相关代理商/技术参数 |
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| PCF8598E-2P | 制造商:未知厂家 制造商全称:未知厂家 功能描述:I2C Serial EEPROM |
| PCF8598E-2T | 制造商:未知厂家 制造商全称:未知厂家 功能描述:I2C Serial EEPROM |
| PCF8598P | 制造商:未知厂家 制造商全称:未知厂家 功能描述:I2C Serial EEPROM |
| PCF8598T | 制造商:未知厂家 制造商全称:未知厂家 功能描述:I2C Serial EEPROM |
| PCF85XXC-2 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:256 to 1024 ⅴ 8-bit CMOS EEPROMs with I2C-bus interface |
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