参数资料
型号: PIC12F683T-E/MF
厂商: Microchip Technology
文件页数: 76/176页
文件大小: 0K
描述: IC MCU FLASH 2KX14 8DFN
Digi-Key 应用说明: AN0005 PWM Example with Microchip's CCP Module
AN0005 Example Code
标准包装: 3,300
系列: PIC® 12F
核心处理器: PIC
芯体尺寸: 8-位
速度: 20MHz
外围设备: 欠压检测/复位,POR,PWM,WDT
输入/输出数: 5
程序存储器容量: 3.5KB(2K x 14)
程序存储器类型: 闪存
EEPROM 大小: 256 x 8
RAM 容量: 128 x 8
电压 - 电源 (Vcc/Vdd): 2 V ~ 5.5 V
数据转换器: A/D 4x10b
振荡器型: 内部
工作温度: -40°C ~ 125°C
封装/外壳: 8-VDFN 裸露焊盘
包装: 带卷 (TR)
配用: AC164324-ND - MODULE SKT FOR MPLAB 8DFN/16QFN
XLT08DFN2-ND - SOCKET TRANSITION ICE 14DIP/8DFN
AC162058-ND - HEADER MPLAB ICD2 FOR PIC12F683
I3-DB12F683-ND - BOARD DAUGHTER ICEPIC3
XLT08DFN-ND - SOCKET TRANSITION ICE 8DFN
AC164032-ND - ADAPTER PICSTART PLUS 8DFN/DIP
AC124001-ND - MODULE SKT PROMATEII 8DIP/SOIC
2007 Microchip Technology Inc.
DS41211D-page 165
PIC12F683
APPENDIX A:
DATA SHEET
REVISION HISTORY
Revision A
This is a new data sheet.
Revision B
Rewrites of the Oscillator and Special Features of the
CPU sections. General corrections to Figures and
formatting.
Revision C
Revisions throughout document. Incorporated Golden
Chapters.
Revision D
Replaced Package Drawings; Revised Product ID
Section (SN package to 3.90 mm); Replaced PICmicro
with PIC; Replaced Dev Tool Section.
APPENDIX B:
MIGRATING FROM
OTHER PIC
DEVICES
This discusses some of the issues in migrating from
other PIC devices to the PIC12F683 device.
B.1
PIC16F676 to PIC12F683
TABLE B-1:
FEATURE COMPARISON
Feature
PIC16F676
PIC12F683
Max Operating
Speed
20 MHz
Max Program
Memory (Words)
1024
2048
SRAM (bytes)
64
128
A/D Resolution
10-bit
Data EEPROM
(Bytes)
128
256
Timers (8/16-bit)
1/1
2/1
Oscillator Modes
8
Brown-out Reset
Y
Internal Pull-ups
RA0/1/2/4/5
GP0/1/2/4/5,
MCLR
Interrupt-on-change
RA0/1/2/3/4/5 GP0/1/2/3/4/5
Comparator
1
ECCP
N
Ultra Low-Power
Wake-Up
NY
Extended WDT
N
Y
Software Control
Option of WDT/BOR
NY
INTOSC
Frequencies
4MHz
32 kHz-
8MHz
Clock Switching
N
Y
Note:
This device has been designed to perform
to the parameters of its data sheet. It has
been tested to an electrical specification
designed to determine its conformance
with these parameters. Due to process
differences in the manufacture of this
device, this device may have different
performance characteristics than its earlier
version. These differences may cause this
device to perform differently in your
application than the earlier version of this
device.
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