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参数资料
型号： PIC12LC671-04/P
厂商： Microchip Technology
文件页数： 93/129页
文件大小： 0K
描述： IC MCU OTP 1KX14 LV A/D 8DIP
产品培训模块： Asynchronous Stimulus
标准包装： 60
系列： PIC® 12C
核心处理器： PIC
芯体尺寸： 8-位
速度： 4MHz
外围设备： POR，WDT
输入/输出数： 5
程序存储器容量： 1.75KB（1K x 14）
程序存储器类型： OTP
RAM 容量： 128 x 8
电压 - 电源 (Vcc/Vdd)： 2.5 V ~ 5.5 V
数据转换器： A/D 4x8b
振荡器型： 内部
工作温度： 0°C ~ 70°C
封装/外壳： 8-DIP（0.300"，7.62mm）
包装： 管件
配用： 309-1051-ND - ADAPTER 8-DIP BD W/2 SO PLUGS
PIC12C67X
DS30561B-page 66
1999 Microchip Technology Inc.
9.8
Power-down Mode (SLEEP)
Power-down mode is entered by executing a SLEEP
instruction.
If enabled, the Watchdog Timer will be cleared but
keeps running, the PD bit (STATUS<3>) is cleared, the
TO (STATUS<4>) bit is set, and the oscillator driver is
turned off. The I/O ports maintain the status they had,
before the SLEEP instruction was executed (driving
high, low or hi-impedance).
For lowest current consumption in this mode, place all
I/O pins at either VDD or VSS, ensure no external cir-
cuitry is drawing current from the I/O pin, power-down
the A/D, and disable external clocks. Pull all I/O pins
that are hi-impedance inputs, high or low externally, to
avoid switching currents caused by floating inputs. The
T0CKI input, if enabled, should also be at VDD or VSS
for lowest current consumption. The contribution from
on-chip pull-ups on GPIO should be considered.
The MCLR pin, if enabled, must be at a logic high level
(VIHMC).
9.8.1
WAKE-UP FROM SLEEP
The device can wake-up from SLEEP through one of
the following events:
1.
External reset input on MCLR pin.
2.
Watchdog
Timer
Wake-up
(if
WDT
was
enabled).
3.
GP2/INT interrupt, interrupt GPIO port change
or some Peripheral Interrupts.
External MCLR Reset will cause a device reset. All
other events are considered a continuation of program
execution and cause a "wake-up". The TO and PD bits
in the STATUS register can be used to determine the
cause of device reset. The PD bit, which is set on
power-up, is cleared when SLEEP is invoked. The TO
bit is cleared if a WDT time-out occurred (and caused
wake-up).
The following peripheral interrupt can wake the device
from SLEEP:
1.
A/D conversion (when A/D clock source is RC).
Other peripherals can not generate interrupts since
during SLEEP, no on-chip Q clocks are present.
When the SLEEP instruction is being executed, the next
instruction (PC + 1) is pre-fetched. For the device to
wake-up through an interrupt event, the corresponding
interrupt enable bit must be set (enabled). Wake-up is
regardless of the state of the GIE bit. If the GIE bit is
clear (disabled), the device continues execution at the
instruction after the SLEEP instruction. If the GIE bit is
set (enabled), the device executes the instruction after
the SLEEP instruction and then branches to the inter-
rupt address (0004h). In cases where the execution of
the instruction following SLEEP is not desirable, the
user should have a NOP after the SLEEP instruction.
9.8.2
WAKE-UP USING INTERRUPTS
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and interrupt flag bit set, one of the following will occur:
If the interrupt occurs before the the execution of
a SLEEP instruction, the SLEEP instruction will
complete as a NOP. Therefore, the WDT and WDT
postscaler will not be cleared, the TO bit will not
be set and PD bits will not be cleared.
If the interrupt occurs during or after the execu-
tion of a SLEEP instruction, the device will imme-
diately wake-up from sleep . The SLEEP
instruction will be completely executed before the
wake-up. Therefore, the WDT and WDT
postscaler will be cleared, the TO bit will be set
and the PD bit will be cleared.
Even if the flag bits were checked before executing a
SLEEP
instruction, it may be possible for flag bits to
become set before the SLEEP instruction completes. To
determine whether a SLEEP instruction executed, test
the PD bit. If the PD bit is set, the SLEEP instruction
was executed as a NOP.
To ensure that the WDT is cleared, a CLRWDT instruc-
tion should be executed before a SLEEP instruction.
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相关代理商/技术参数
参数描述
PIC12LC671T-04/SM 功能描述:8位微控制器 -MCU 1.75KB 128 RAM 6 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC12LC671T-04I/MF 功能描述:8位微控制器 -MCU .75KB 25 RAM 6 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC12LC671T-04I/SM 功能描述:8位微控制器 -MCU 1.75KB 128 RAM 6 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC12LC672-04/P 功能描述:8位微控制器 -MCU 3.5KB 128 RAM 6 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC12LC672-04/SM 功能描述:8位微控制器 -MCU 3.5KB 128 RAM 6 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
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