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| 型号： | PIC16F716-E/SO |
| 厂商： | Microchip Technology |
| 文件页数： | 100/136页 |
| 文件大小： | 0K |
| 描述： | IC PIC MCU FLASH 2KX14 18SOIC |
| 产品培训模块： | Asynchronous Stimulus |
| 标准包装： | 42 |
| 系列： | PIC® 16F |
| 核心处理器： | PIC |
| 芯体尺寸： | 8-位 |
| 速度： | 20MHz |
| 外围设备： | 欠压检测/复位，POR，PWM，WDT |
| 输入/输出数： | 13 |
| 程序存储器容量： | 3.5KB（2K x 14） |
| 程序存储器类型： | 闪存 |
| RAM 容量： | 128 x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 3 V ~ 5.5 V |
| 数据转换器： | A/D 4x8b |
| 振荡器型： | 内部 |
| 工作温度： | -40°C ~ 125°C |
| 封装/外壳： | 18-SOIC（0.295"，7.50mm 宽） |
| 包装： | 管件 |
| 配用： | I3-DB16F716-ND - BOARD DAUGHTER ICEPIC3 AC162054-ND - HEADER INTERFACE ICD2 16F716 |
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PIC16F716
DS41206B-page 64
2007 Microchip Technology Inc.
9.2.3
RC OSCILLATOR
For timing insensitive applications, the “RC” device
option offers additional cost savings. The RC oscillator
frequency is a function of the supply voltage, the
resistor (REXT) and capacitor (CEXT) values and the
operating temperature. In addition to this, the oscillator
frequency will vary from unit-to-unit due to normal
process
parameter
variation.
Furthermore,
the
difference in lead frame capacitance between package
types will also affect the oscillation frequency,
especially for low CEXT values. The user also needs to
take into account variation due to tolerance of external
R and C components used. Figure 9-3 shows how the
R/C combination is connected to the PIC16F716.
FIGURE 9-3:
RC OSCILLATOR MODE
9.3
Reset
The PIC16F716 differentiates between various kinds of
Reset:
Power-on Reset (POR)
MCLR Reset during normal operation
MCLR Reset during Sleep
WDT Reset (during normal operation)
WDT Wake-up (during Sleep)
Brown-out Reset (BOR)
Some registers are not affected in any Reset condition;
their status is unknown on POR and unchanged in any
other Reset. Most other registers are reset to a “Reset
state” on Power-on Reset (POR), on the MCLR and
WDT Reset, on MCLR Reset during Sleep and
Brown-out Reset (BOR). They are not affected by a
WDT Wake-up, which is viewed as the resumption of
normal operation. The TO and PD bits are set or
cleared differently in different Reset situations as indi-
cated in Table 9-4. These bits are used in software to
determine the nature of the Reset. See Table 9-6 for a
full description of Reset states of all registers.
A simplified block diagram of the On-chip Reset circuit
is shown in Figure 9-5.
The PIC microcontrollers have an MCLR noise filter in
the MCLR Reset path. The filter will detect and ignore
small pulses.
It should be noted that a WDT Reset does not drive the
MCLR pin low.
9.4
Power-On Reset (POR)
A Power-on Reset pulse is generated on-chip when
VDD rise is detected. To take advantage of the POR,
just tie the MCLR pin directly (or through a resistor) to
VDD. This will eliminate external RC components
usually needed to create a Power-on Reset. A
maximum rise time for VDD is specified (parameter
D004). For a slow rise time, see Figure 9-4.
When the device starts normal operation (exits the
Reset
condition),
device
operating
parameters
(voltage, frequency, temperature,...) must be met to
ensure operation. If these conditions are not met, the
device must be held in Reset until the operating
conditions are met. Brown-out Reset may be used to
meet the start-up conditions.
FIGURE 9-4:
EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW VDD POWER-UP)
OSC2/CLKOUT
CEXT
REXT
PIC16F716
OSC1
FOSC/4
Internal
clock
VDD
VSS
Recommended values:
3k
Ω ≤ REXT ≤ 100 kΩ (VDD ≥ 3.0V)
10 k
Ω ≤ REXT ≤ 100 kΩ (VDD ≥ 3.0V)
CEXT
> 20 pF
Note 1:
External Power-on Reset circuit is required
only if VDD power-up slope is too slow. The
diode D helps discharge the capacitor quickly
when VDD powers down.
2:
R < 40 k
Ω is recommended to make sure that
voltage drop across R does not violate the
device’s electrical specification.
3:
R1 = 100
Ω to 1 kΩ will limit any current
flowing into MCLR from external capacitor C
in the event of MCLR/VPP pin breakdown due
to Electrostatic Discharge (ESD) or Electrical
Overstress
(EOS).
C
R1
R
VDD
MCLR
PIC16F716
VDD
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相关代理商/技术参数 |
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| PIC16F716-I/ML | 功能描述:IC PIC MCU FLASH 2KX14 28QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:PIC® 16F 产品培训模块:XLP Deep Sleep Mode 8-bit PIC® Microcontroller Portfolio 标准包装:22 系列:PIC® XLP™ 18F 核心处理器:PIC 芯体尺寸:8-位 速度:48MHz 连通性:I²C，SPI，UART/USART，USB 外围设备:欠压检测/复位，POR，PWM，WDT 输入/输出数:14 程序存储器容量:8KB（4K x 16） 程序存储器类型:闪存 EEPROM 大小:256 x 8 RAM 容量:512 x 8 电压 - 电源 (Vcc/Vdd):1.8 V ~ 5.5 V 数据转换器:A/D 11x10b 振荡器型:内部 工作温度:-40°C ~ 85°C 封装/外壳:20-DIP（0.300"，7.62mm） 包装:管件 产品目录页面:642 (CN2011-ZH PDF) 配用:DV164126-ND - KIT DEVELOPMENT USB W/PICKIT 2DM164127-ND - KIT DEVELOPMENT USB 18F14/13K50AC164112-ND - VOLTAGE LIMITER MPLAB ICD2 VPP |
| PIC16F716-I/P | 功能描述:8位微控制器 -MCU 3.5KB 128 RAM 13 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| PIC16F716-I/P | 制造商:Microchip Technology Inc 功能描述:IC 8BIT FLASH MCU 16F716 DIP18 |
| PIC16F716-I/SO | 功能描述:8位微控制器 -MCU 3.5KB 128 RAM 13 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| PIC16F716-I/SO | 制造商:Microchip Technology Inc 功能描述:8BIT FLASH MCU SMD 16F716 SOIC18 |
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