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参数资料
| 型号： | PIC16F84A-04/SO |
| 厂商： | Microchip Technology |
| 文件页数： | 78/81页 |
| 文件大小： | 0K |
| 描述： | IC MCU FLASH 1KX14 EE 18SOIC |
| 产品培训模块： | Asynchronous Stimulus 8-bit PIC® Microcontroller Portfolio |
| 标准包装： | 42 |
| 系列： | PIC® 16F |
| 核心处理器： | PIC |
| 芯体尺寸： | 8-位 |
| 速度： | 4MHz |
| 外围设备： | POR，WDT |
| 输入/输出数： | 13 |
| 程序存储器容量： | 1.75KB（1K x 14） |
| 程序存储器类型： | 闪存 |
| EEPROM 大小： | 64 x 8 |
| RAM 容量： | 68 x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 4 V ~ 5.5 V |
| 振荡器型： | 外部 |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 18-SOIC（0.295"，7.50mm 宽） |
| 包装： | 管件 |
| 产品目录页面： | 638 (CN2011-ZH PDF) |
| 配用： | XLT18SO-1-ND - SOCKET TRANSITION 18SOIC 300MIL I3-DB16F84A-ND - BOARD DAUGHTER ICEPIC3 309-1075-ND - ADAPTER 18-SOIC TO 18-SOIC 309-1011-ND - ADAPTER 18-SOIC TO 18-DIP 309-1010-ND - ADAPTER 18-SOIC TO 18-DIP AC164010-ND - MODULE SKT PROMATEII DIP/SOIC |
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PIC16F84A
DS35007B-page 6
2001 Microchip Technology Inc.
2.2
Data Memory Organization
The data memory is partitioned into two areas. The first
is the Special Function Registers (SFR) area, while the
second is the General Purpose Registers (GPR) area.
The SFRs control the operation of the device.
Portions of data memory are banked. This is for both
the SFR area and the GPR area. The GPR area is
banked to allow greater than 116 bytes of general
purpose RAM. The banked areas of the SFR are for the
registers that control the peripheral functions. Banking
requires the use of control bits for bank selection.
These control bits are located in the STATUS Register.
Figure 2-2 shows the data memory map organization.
Instructions MOVWF and MOVF can move values from
the W register to any location in the register file (“F”),
and vice-versa.
The entire data memory can be accessed either
directly using the absolute address of each register file
or indirectly through the File Select Register (FSR)
(Section 2.5). Indirect addressing uses the present
value of the RP0 bit for access into the banked areas of
data memory.
Data memory is partitioned into two banks which
contain the general purpose registers and the special
function registers. Bank 0 is selected by clearing the
RP0 bit (STATUS<5>). Setting the RP0 bit selects Bank
1. Each Bank extends up to 7Fh (128 bytes). The first
twelve locations of each Bank are reserved for the
Special Function Registers. The remainder are Gen-
eral Purpose Registers, implemented as static RAM.
2.2.1
GENERAL PURPOSE REGISTER
FILE
Each General Purpose Register (GPR) is 8-bits wide
and is accessed either directly or indirectly through the
FSR (Section 2.5).
The GPR addresses in Bank 1 are mapped to
addresses in Bank 0. As an example, addressing loca-
tion 0Ch or 8Ch will access the same GPR.
FIGURE 2-2:
REGISTER FILE MAP -
PIC16F84A
File Address
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
7Fh
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
FFh
Bank 0
Bank 1
Indirect addr.(1)
TMR0
OPTION_REG
PCL
STATUS
FSR
PORTA
PORTB
EEDATA
EEADR
PCLATH
INTCON
68
General
Purpose
Registers
(SRAM)
PCL
STATUS
FSR
TRISA
TRISB
EECON1
EECON2(1)
PCLATH
INTCON
Mapped
in Bank 0
Unimplemented data memory location, read as ’0’.
File Address
Note
1:
Not a physical register.
CFh
D0h
4Fh
50h
(accesses)
—
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| PIC16F84A-20/P | 功能描述:8位微控制器 -MCU 1.75KB 68 RAM 13 I/O 20MHz PDIP18 RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| PIC16F84A-20/P | 制造商:Microchip Technology Inc 功能描述:IC 8BIT FLASH MCU 16F84 DIP18 |
| PIC16F84A-20/SO | 功能描述:8位微控制器 -MCU 1.75KB 68 RAM 13 I/O 20MHz SOIC18 RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| PIC16F84A-20/SO | 制造商:Microchip Technology Inc 功能描述:8BIT FLASH MCU SMD 16F84 SOIC18 |
| PIC16F84A-20/SS | 功能描述:8位微控制器 -MCU 1.75KB 68 RAM 13 I/O 20MHz SSOP20 RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
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