参数资料
型号: PIC18F26J50T-I/SO
厂商: Microchip Technology
文件页数: 32/32页
文件大小: 0K
描述: IC PIC MCU FLASH 64KB 28-SOIC
产品培训模块: PIC18 J Series MCU Overview
标准包装: 1,600
系列: PIC® XLP™ 18F
核心处理器: PIC
芯体尺寸: 8-位
速度: 48MHz
连通性: I²C,SPI,UART/USART,USB
外围设备: 欠压检测/复位,DMA,POR,PWM,WDT
输入/输出数: 16
程序存储器容量: 64KB(32K x 16)
程序存储器类型: 闪存
RAM 容量: 3.8K x 8
电压 - 电源 (Vcc/Vdd): 2.15 V ~ 3.6 V
数据转换器: A/D 10x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 28-SOIC(0.295",7.50mm 宽)
包装: 带卷 (TR)
2009 Microchip Technology Inc.
DS39687E-page 9
PIC18F2XJXX/4XJXX FAMILY
3.0
DEVICE PROGRAMMING
Programming includes the ability to erase or write the
memory within the device.
The EECON1 register is used to control Write or Row
Erase operations. The WREN bit must be set to enable
writes; this must be done prior to initiating a write
sequence. It is strongly recommended that the WREN
bit only be set immediately prior to a program or erase
operation.
The FREE bit must be set in order to erase the program
space being pointed to by the Table Pointer. The erase
or write sequence is initiated by setting the WR bit.
3.1
ICSP Erase
3.1.1
ICSP BULK ERASE
Devices of the PIC18F2XJXX/4XJXX family may be
Bulk Erased by writing 0180h to the table address,
3C0005h:3C0004h. The basic sequence is shown in
Table 3-1 and demonstrated in Figure 3-1.
Since the code-protect Configuration bit is stored in the
program code within code memory, a Bulk Erase
operation will also clear any code-protect settings for
the device.
The actual Bulk Erase function is a self-timed opera-
tion. Once the erase has started (falling edge of the 4th
PGC after the NOP command), serial execution will
cease until the erase completes (parameter P11).
During this time, PGC may continue to toggle but PGD
must be held low.
TABLE 3-1:
BULK ERASE COMMAND
SEQUENCE
FIGURE 3-1:
BULK ERASE FLOW
FIGURE 3-2:
BULK ERASE TIMING
4-Bit
Command
Data
Payload
Core Instruction
0000
1100
0000
1100
0000
0E 3C
6E F8
0E 00
6E F7
0E 05
6E F6
01 01
0E 3C
6E F8
0E 00
6E F7
0E 04
6E F6
80 80
00 00
MOVLW 3Ch
MOVWF TBLPTRU
MOVLW 00h
MOVWF TBLPTRH
MOVLW 05h
MOVWF TBLPTRL
Write 01h to 3C0005h
MOVLW 3Ch
MOVWF TBLPTRU
MOVLW 00h
MOVWF TBLPTRH
MOVLW 04h
MOVWF TBLPTRL
Write 80h TO 3C0004h to
erase entire device.
NOP
Hold PGD low until erase
completes.
Start
Done
Write 8080h to
3C0004h to Erase
Entire Device
Write 0101h
Delay P11 + P10
Time
to 3C0005h
n
12
3
4
1
215 16
12
3
PGC
P5
P5A
PGD
PGD = Input
0
00
1
P11
P10
Erase Time
00
0
12
00
4
0
1
2
15 16
P5
12
3
P5A
4
000
0
n
4-Bit Command
16-Bit
Data Payload
16-Bit
Data Payload
16-Bit
Data Payload
11
相关PDF资料
PDF描述
ADG1608BRUZ IC MULTIPLEXER 8X1 16TSSOP
ADG1414BRUZ IC SW SPST 9.5OHM RON 24TSSOP
ADG1409YRUZ IC MULTIPLEXER DUAL 4X1 16TSSOP
ADG1408YRUZ IC MULTIPLEXER 8X1 16TSSOP
ADG1439BRUZ IC MULTIPLEXER DL 4X1 20TSSOP
相关代理商/技术参数
参数描述
PIC18F26J53-I/ML 功能描述:8位微控制器 -MCU 64KB 4KBRAM 12MIPS nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F26J53-I/SO 功能描述:8位微控制器 -MCU 64KB Flash 4KB RAM 12MIPS nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F26J53-I/SP 功能描述:8位微控制器 -MCU 64KB FLASH 4KBRAM 12 MIPS nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F26J53-I/SS 功能描述:8位微控制器 -MCU 64KB 4KBRAM 12MIPS nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F26J53T-I/ML 功能描述:8位微控制器 -MCU USB 64KB Flash 4KB RAM 12 MIPS 12b ADC RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT