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| 型号： | PIC18F452-I/PT |
| 厂商： | Microchip Technology |
| 文件页数： | 8/134页 |
| 文件大小： | 0K |
| 描述： | IC MCU FLASH 16KX16 EE 44TQFP |
| 产品培训模块： | Asynchronous Stimulus 8-bit PIC® Microcontroller Portfolio |
| 标准包装： | 160 |
| 系列： | PIC® 18F |
| 核心处理器： | PIC |
| 芯体尺寸： | 8-位 |
| 速度： | 40MHz |
| 连通性： | I²C，SPI，UART/USART |
| 外围设备： | 欠压检测/复位，LVD，POR，PWM，WDT |
| 输入/输出数： | 34 |
| 程序存储器容量： | 32KB（16K x 16） |
| 程序存储器类型： | 闪存 |
| EEPROM 大小： | 256 x 8 |
| RAM 容量： | 1.5K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 4.2 V ~ 5.5 V |
| 数据转换器： | A/D 8x10b |
| 振荡器型： | 外部 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 44-TQFP |
| 包装： | 托盘 |
| 配用： | XLT44PT3-ND - SOCKET TRAN ICE 44MQFP/TQFP AC164305-ND - MODULE SKT FOR PM3 44TQFP 444-1001-ND - DEMO BOARD FOR PICMICRO MCU AC164020-ND - MODULE SKT PROMATEII 44TQFP |
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1997 Microchip Technology Inc.
DS30444E - page 105
PIC16C9XX
14.2.3
EXTERNAL CRYSTAL OSCILLATOR
CIRCUIT
Either a prepackaged oscillator can be used or a simple
oscillator circuit with TTL gates can be built. Prepack-
aged oscillators provide a wide operating range and
better stability. A well-designed crystal oscillator will
provide good performance with TTL gates. Two types of
crystal oscillator circuits can be used; one with series
resonance, or one with parallel resonance.
Figure 14-4 shows implementation of a parallel reso-
nant oscillator circuit. The circuit is designed to use the
fundamental frequency of the crystal. The 74AS04
inverter performs the 180-degree phase shift that a par-
allel oscillator requires. The 4.7 k
resistor provides the
negative feedback for stability. The 10 k
potentiometer
biases the 74AS04 in the linear region. This could be
used for external oscillator designs.
FIGURE 14-4: EXTERNAL PARALLEL
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
Figure 14-5 shows a series resonant oscillator circuit.
This circuit is also designed to use the fundamental fre-
quency of the crystal. The inverter performs a
180-degree phase shift in a series resonant oscillator
circuit. The 330 k
resistors provide the negative feed-
back to bias the inverters in their linear region.
FIGURE 14-5: EXTERNAL SERIES
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
20 pF
+5V
20 pF
10k
4.7k
10k
74AS04
XTAL
10k
74AS04
CLKIN
To Other
Devices
PIC16CXXX
330 k
74AS04
PIC16CXXX
CLKIN
To Other
Devices
XTAL
330 k
74AS04
0.1
F
14.2.4
RC OSCILLATOR
For timing insensitive applications the “RC” device
option offers additional cost savings. The RC oscillator
frequency is a function of the supply voltage, the resis-
tor (REXT) and capacitor (CEXT) values, and the operat-
ing temperature. In addition to this, the oscillator
frequency will vary from unit to unit due to normal pro-
cess parameter variation. Furthermore, the difference
in lead frame capacitance between package types will
also affect the oscillation frequency, especially for low
CEXT values. The user also needs to take into account
variation due to tolerance of external R and C compo-
nents used. Figure 14-6 shows how the R/C combina-
tion is connected to the PIC16CXXX. For REXT values
below 2.2 k
, the oscillator operation may become
unstable, or stop completely. For very high REXT values
(e.g. 1 M
), the oscillator becomes sensitive to noise,
humidity and leakage. Thus, we recommend to keep
Rext between 3 k
and 100 k.
Although the oscillator will operate with no external
capacitor (CEXT = 0 pF), we recommend using values
above 20 pF for noise and stability reasons. With no or
small external capacitance, the oscillation frequency
can vary dramatically due to changes in external
capacitances, such as PCB trace capacitance or pack-
age lead frame capacitance.
See characterization data for desired device for RC fre-
quency variation from part to part due to normal pro-
cess variation. The variation is larger for larger R (since
leakage current variation will affect RC frequency more
for large R) and for smaller C (since variation of input
capacitance will affect RC frequency more).
See characterization data for desired device for varia-
tion of oscillator frequency due to VDD for given
REXT/CEXT values as well as frequency variation due to
operating temperature for given R, C, and VDD values.
The oscillator frequency, divided by 4, is available on
the OSC2/CLKOUT pin, and can be used for test pur-
poses or to synchronize other logic (see Figure 3-3 for
waveform).
FIGURE 14-6: RC OSCILLATOR MODE
OSC2/CLKOUT
CEXT
VDD
REXT
VSS
PIC16CXXX
OSC1
Fosc/4
Internal
clock
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| PIC18F452T-E/ML | 功能描述:8位微控制器 -MCU 40MHz 16KB Flash RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| PIC18F452T-I/L | 功能描述:8位微控制器 -MCU 32KB 1536 RAM 34I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| PIC18F452T-I/ML | 功能描述:8位微控制器 -MCU 32KB 1536 RAM 34I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| PIC18F452T-I/PT | 功能描述:8位微控制器 -MCU 32KB 1536 RAM 34I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| PIC18F452T-I/PTG | 功能描述:8位微控制器 -MCU 32KB 1536 RAM 34I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
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