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| 型号： | PIP201-12M-3,518 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 稳压器 |
| 英文描述： | 200 A SWITCHING REGULATOR, PQCC68 |
| 封装： | 10 X 10 MM, 0.85 MM HEIGHT, PLASTIC, SOT-687-1, HVQFN-68 |
| 文件页数： | 4/20页 |
| 文件大小： | 345K |
| 代理商： | PIP201-12M-3,518 |
Philips Semiconductors
PIP201-12M-3
DC-to-DC converter powertrain
Product data
Rev. 03 — 19 November 2003
12 of 20
9397 750 11942
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
printed-circuit board is approximately 5 K/W. In order to take full advantage of the low
thermal resistance of this package, the printed-circuit board must be designed so that
heat is conducted away efciently from the package. This can be achieved by
maximizing the area of copper around each pad, and by incorporating thermal vias to
conduct the heat to inner and/or bottom layers of the printed-circuit board.
An example of a thermal via pattern is shown in Figure 13. In a typical application,
with no forced air cooling, the use of thermal vias typically reduces the thermal
resistance from 25 K/W to 20 K/W. The additional use of a small fan can reduce this
further to approximately 15 K/W.
The thermal resistance of a particular design can be measured by passing a known
current through the source-drain diode of the lower MOSFET. The direction of current
ow is into VSSO and out of VO. The volt drop between VSSO and VO is then measured
and used to calculate the power dissipation in the PIP201-12M. The case
temperature of the PIP201-12M can be measured using an infra-red thermometer.
The thermal resistance can then be calculated using the following equation:
(3)
where Tcase is the measured case temperature (°C), Tamb is the ambient
temperature (
°C), I is the MOSFET current (A), and VF is the voltage drop between
VSSO and VDDO (V).
Where more than one phase is used, for example the circuit of Figure 11, the thermal
resistance of each PIP201-12M should be measured with current owing in all
phases.
12. Test information
Figure 14 shows the test circuit used to measure power loss in the PIP201-12M. The
output voltage is measured using an averaging circuit. This eliminates losses in the
output inductor and the PCB tracks. The calculated power loss, using this method,
All holes 0.5 mm diameter with 1 mm spacing.
Fig 13. Printed-circuit board thermal via pattern.
03ag36
PAD1
PAD2
PAD3
R
th j
pcb
–
()
T
case
T
amb
–
IV
F
×
------------------------------- KW
()
=
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PIP202-12M | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:DC to DC converter powertrain |
| PIP202-12M-2 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:DC-to-DC converter powertrain |
| PIP202-12M-2 /T3 | 功能描述:直流/直流开关转换器 TAPE7 MOSFET RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT |
| PIP202-12M-2,518 | 功能描述:直流/直流开关调节器 TAPE7 MOSFET RoHS:否 制造商:International Rectifier 最大输入电压:21 V 开关频率:1.5 MHz 输出电压:0.5 V to 0.86 V 输出电流:4 A 输出端数量: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PQFN 4 x 5 |
| PIP20-5,08 | 功能描述:可插拔接线端子 PCB Hdr, 45 Deg, 5,08 PitchClosed End,20pole,12A,300V,Grn RoHS:否 制造商:Phoenix Contact 产品:Plugs 系列:PTS 端接类型:Spring Cage 位置/触点数量:5 线规量程:26-14 节距:5 mm 电流额定值:10 A 电压额定值:250 V 安装风格: 安装角: 触点电镀: |
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