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参数资料
| 型号： | PIP201-12M-3,518 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 稳压器 |
| 英文描述： | 200 A SWITCHING REGULATOR, PQCC68 |
| 封装： | 10 X 10 MM, 0.85 MM HEIGHT, PLASTIC, SOT-687-1, HVQFN-68 |
| 文件页数： | 8/20页 |
| 文件大小： | 345K |
| 代理商： | PIP201-12M-3,518 |
Philips Semiconductors
PIP201-12M-3
DC-to-DC converter powertrain
Product data
Rev. 03 — 19 November 2003
16 of 20
9397 750 11942
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
15.2 Rework guidelines
Since the solder joints are largely inaccessible, only the side llets can be touched
up. If there are defects underneath the package, then the whole package has to be
removed.
The rst step in component removal is to reow the solder joints. It is recommended
that the board is heated from the underside using a convective heater whilst hot air or
gas is directed at the upper surface of the component. Nozzles should be used to
direct the hot air or gas to minimize heating of adjacent components. Excessive
airow should be avoided since this may cause the package to skew. An airow
velocity of 15 to 20 liters per minute is usually adequate.
Once the solder joints have reowed, the component should be lifted off the board
using a vacuum pen.
The next step is to clean the solder pads using solder braid and a blade-style
soldering tool. Finally, the pads should be cleaned with a solvent. The solvent is
usually specic to the type of solder paste used in the original assembly and the
paste manufacturers recommendations should be followed.
16. Mounting
16.1 PCB design guidelines
The terminals on the underside of the package are rectangular in shape with a
rounded edge on the inside. Electrical connection between the package and the
printed-circuit board is made by printing solder paste onto the PCB footprint followed
by component placement and reow soldering. The PCB footprint shown in Figure 20
is designed to form reliable solder joints.
The use of solder resist between each solder land is recommended. PCB tracks
should not be routed through the corner areas shown in Figure 20. This is because
there is a small, exposed remnant of the leadframe in each corner of the package, left
over from the cropping process.
Good surface atness of the PCB lands is desirable to ensure accuracy of placement
after soldering. Printed-circuit boards that are nished with a roller tin process tend to
leave small lumps of tin in the corners of each land. Levelling with a hot air knife
improves atness. Alternatively, an electro-less silver or silver immersion process
produces completely at PCB lands.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PIP202-12M | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:DC to DC converter powertrain |
| PIP202-12M-2 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:DC-to-DC converter powertrain |
| PIP202-12M-2 /T3 | 功能描述:直流/直流开关转换器 TAPE7 MOSFET RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT |
| PIP202-12M-2,518 | 功能描述:直流/直流开关调节器 TAPE7 MOSFET RoHS:否 制造商:International Rectifier 最大输入电压:21 V 开关频率:1.5 MHz 输出电压:0.5 V to 0.86 V 输出电流:4 A 输出端数量: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PQFN 4 x 5 |
| PIP20-5,08 | 功能描述:可插拔接线端子 PCB Hdr, 45 Deg, 5,08 PitchClosed End,20pole,12A,300V,Grn RoHS:否 制造商:Phoenix Contact 产品:Plugs 系列:PTS 端接类型:Spring Cage 位置/触点数量:5 线规量程:26-14 节距:5 mm 电流额定值:10 A 电压额定值:250 V 安装风格: 安装角: 触点电镀: |
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