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| 型号： | PIP201-12M-3,518 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 稳压器 |
| 英文描述： | 200 A SWITCHING REGULATOR, PQCC68 |
| 封装： | 10 X 10 MM, 0.85 MM HEIGHT, PLASTIC, SOT-687-1, HVQFN-68 |
| 文件页数： | 7/20页 |
| 文件大小： | 345K |
| 代理商： | PIP201-12M-3,518 |
Philips Semiconductors
PIP201-12M-3
DC-to-DC converter powertrain
Product data
Rev. 03 — 19 November 2003
15 of 20
9397 750 11942
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
15. Soldering
15.1 Introduction to soldering MLF packages
The MicroLeadFrame package (MLF) is a near Chip Scale Package (CSP) with a
copper leadframe. It is a leadless package, where electrical contact to the printed
circuit board is made through metal pads on the underside of the package. In addition
to the small pads around the periphery of the package, there are large pads on the
underside that provide low thermal resistance, low electrical resistance, low
inductance connections between the power components inside the MLF package and
the printed-circuit board. It is this feature of the MLF package that makes it ideally
suited for VRM applications.
Electrical connection between the package and the printed circuit board is made by
printing solder paste on the printed circuit board, placing the component and
reowing the solder in a convection or infra-red oven. The solder reow process is
ensure good solder joints, the peak temperature Tp should not exceed 220 °C for thin
packages such as MLF, and the time above liquidus temperature should be less than
1.25 minutes. The maximum temperature can be increased for lead free solder. The
ramp rate during preheat should not exceed 3 K/s. Nitrogen purge is recommended
during reow.
Fig 18. Typical reow soldering process ow.
Fig 19. Typical reow soldering temperature prole.
SOLDER PASTE
PRINTING
POST PRINT
INSPECTION
COMPONENT
PLACEMENT
PRE REFLOW
INSPECTION
REFLOW SOLDERING
POST REFLOW INSPECTION
(PREFERABLY X-RAY)
REWORK AND
TOUCH UP
03aj25
03aj26
0
100
200
300
01
23
time (minutes)
Temp
Tr
Te
Tp
rate of rise of
temperature < 3 K/s
1 min max
1.25 min max
(
°C)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PIP202-12M | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:DC to DC converter powertrain |
| PIP202-12M-2 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:DC-to-DC converter powertrain |
| PIP202-12M-2 /T3 | 功能描述:直流/直流开关转换器 TAPE7 MOSFET RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT |
| PIP202-12M-2,518 | 功能描述:直流/直流开关调节器 TAPE7 MOSFET RoHS:否 制造商:International Rectifier 最大输入电压:21 V 开关频率:1.5 MHz 输出电压:0.5 V to 0.86 V 输出电流:4 A 输出端数量: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PQFN 4 x 5 |
| PIP20-5,08 | 功能描述:可插拔接线端子 PCB Hdr, 45 Deg, 5,08 PitchClosed End,20pole,12A,300V,Grn RoHS:否 制造商:Phoenix Contact 产品:Plugs 系列:PTS 端接类型:Spring Cage 位置/触点数量:5 线规量程:26-14 节距:5 mm 电流额定值:10 A 电压额定值:250 V 安装风格: 安装角: 触点电镀: |
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