参数资料
型号: PMEG3005EJ,115
厂商: NXP Semiconductors
文件页数: 8/13页
文件大小: 131K
描述: SCHOTTKY RECT 30V 0.5A SOD323F
产品目录绘图: SOD-323 Circuit
标准包装: 3,000
二极管类型: 肖特基
电压 - (Vr)(最大): 30V
电流 - 平均整流 (Io): 500mA(DC)
电压 - 在 If 时为正向 (Vf)(最大): 430mV @ 500mA
速度: 快速恢复 =< 500 ns,> 200mA(Io)
电流 - 在 Vr 时反向漏电: 150µA @ 30V
电容@ Vr, F: 70pF @ 1V,1MHz
安装类型: 表面贴装
封装/外壳: SC-90,SOD-323F
供应商设备封装: SOD-323F
包装: 带卷 (TR)
PMEGXX05EH_EJ_SER_2
? NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 13 January 2010 4 of 13
NXP Semiconductors
PMEGxx05EH/EJ series
0.5 A very low VF
MEGA Schottky barrier rectifiers
6. Thermal characteristics
[1] Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse power
losses PR
are a significant part of the total power lo
sses. Nomograms for determining the reverse power
losses PR
and I
F(AV)
rating will be av
ailable on request.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
Table 7. Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance from junction
in free air
to ambient
[1][2]
SOD123F - - 330 K/W
SOD323F - - 350 K/W
[1][3]
--150K/W
Rth(j-sp)
thermal resistance from junction
to solder point
SOD123F - - 60 K/W
SOD323F - - 55 K/W
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