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参数资料
| 型号： | PT100MC0MP1 |
| 厂商： | Sharp Microelectronics |
| 文件页数： | 6/11页 |
| 文件大小： | 0K |
| 描述： | PHOTOTRANSISTOR CLEAR LENS SMD |
| 标准包装： | 1 |
| 系列： | * |
| 电压 - 集电极发射极击穿（最大）： | 35V |
| 电流 - 集电极 (Ic)（最大）： | 20mA |
| 电流 - 暗 (Id)（最大）： | 100nA |
| 波长： | 900nm |
| 视角： | 30° |
| 功率 - 最大： | 75mW |
| 安装类型： | 表面贴装 |
| 方向： | 通用 |
| 封装/外壳： | 2-SMD，无引线 |
| 其它名称： | 425-2648-6 |
PT100MC0MPx
■ Design Considerations
Design Guidelines
1. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant.
■ Manufacturing Guidelines
Soldering Instructions
1. Sharp recommends soldering no more than once when using solder reflow methods.
2. When using solder reflow methods, follow the reflow soldering temperature profile shown in Fig. 10. Sharp rec-
ommends checking the process to make sure these parameters are not exceeded; exceeding these parameters
can cause substrate bending or other mechanical stresses leading to debonding of the internal gold wires, or
other similar failure modes.
3. If using an infrared lamp to preheat the parts, such heat sources may cause localized high temperatures in the
part's resin. Be sure to keep the temperature profile within the guidelines shown in Fig. 10.
4. If hand soldering, use temperatures ≤ 240° for ≤ 3 seconds. Do not dip-solder or VPS-solder this part.
5. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
Fig. 10 Reflow Soldering Temperature Profile
240°C MAX.
200°C
1 to 4°C/s
165°C MAX.
1 to 4°C/s
1 to 4°C/s
25°C
10s MAX.
60s MAX.
120s MAX.
90s MAX.
Cleaning Instructions
1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the
optical characteristics.
2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.
3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning
time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-
tions to confirm the harmlessness of the ultrasonic cleaning methods.
4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.
Sheet No.: D1-A01701EN
6
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PT100MF0MP | 功能描述:光电晶体管 SMT Phototransistor 15 910nm 3.45mA RoHS:否 制造商:OSRAM Opto Semiconductors 最大功率耗散:165 mW 最大暗电流:200 nA 封装 / 箱体:T-1 |
| PT100MF0MP1 | 功能描述:光电晶体管 PT 15 910nm 3.45mA 1.5Kpcs RoHS:否 制造商:OSRAM Opto Semiconductors 最大功率耗散:165 mW 最大暗电流:200 nA 封装 / 箱体:T-1 |
| PT100MF1MP | 制造商:未知厂家 制造商全称:未知厂家 功能描述:PHOTOTRANSISTOR |
| PT100MF1MP1 | 功能描述:光电晶体管 Darlington output Ver of PT100MF0MP1 RoHS:否 制造商:OSRAM Opto Semiconductors 最大功率耗散:165 mW 最大暗电流:200 nA 封装 / 箱体:T-1 |
| PT100P01 | 制造商:Seiko Instruments Inc (SII) 功能描述: |
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