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参数资料
| 型号： | PT100MF0MP1 |
| 厂商： | Sharp Microelectronics |
| 文件页数： | 7/11页 |
| 文件大小： | 0K |
| 描述： | PHOTO TRANS BLACK LENS 910NM SMD |
| 标准包装： | 1 |
| 系列： | * |
| 电压 - 集电极发射极击穿（最大）： | 35V |
| 电流 - 集电极 (Ic)（最大）： | 20mA |
| 电流 - 暗 (Id)（最大）： | 100nA |
| 波长： | 910nm |
| 视角： | 30° |
| 功率 - 最大： | 75mW |
| 安装类型： | 表面贴装 |
| 方向： | 通用 |
| 封装/外壳： | 2-SMD，无引线 |
| 其它名称： | 425-1007-1 |
PT100MF0MPx
Storage and Handling
1. Store these parts between 5°C and 30°C, at a relative humidity of less than 70 % .
2. After breaking the package seal, maintain the environment within 5°C to 25°C, at a relative humidity of less than
60 % , and mount the parts within two days. If unable to do so, bake before mounting.
3. When storing the parts after breaking the seal, Sharp recommends storage of no longer than two weeks in a dry
box or by resealing the parts in a moisture-proof bag with a desiccant. If unable to do so, bake before mounting.
4. When baking the parts before mounting, Sharp recommends baking the parts only once and only if in a metal
tray or mounted on a PCB. Recommended conditions are for 16 to 24 hours, at a temperature of 125°C.
■ Presence of ODCs (RoHS Compliance)
This product shall not contain the following materials, and they are not used in the production process for this
product:
? Regulated substances: CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform). Specific
brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
? Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl
ethers (PBDE).
? Content information about the six substances specified in “Management Methods for Control of Pollution
Caused by Electronic Information Products Regulation” (Chinese: )
Toxic and Hazdardous Substances
Category
Lead (Pb) mercury (Hg) Cadmium (Cd)
Hexavalent
chromiun (Cr 6+ )
Polybrominated
biphenyls (PBB)
Polybrominated
diphenyl ethers
(PBDE)
Photo Transistor
?
?
?
?
?
?
NOTE: ? indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement
as described in SJ/T 11363-2006 standard.
■ Taping Specifications
1.
2.
3.
4.
5.
6.
Tape structure and dimensions conforms to those shown in Fig. 11 to 16.
Product insertion will have the collector to the hole side of the tape.
Cover tape peel-separation force: F = 0.2 to 1.0 N (where θ 160° to 180°)
Quantity per reel = 2000 pcs. (PT100MF0MP) or 1500 pcs. (PT100MF0MP1)
Product mass: 0.01 g (approx.)
Packaging:
a. Reels are sealed inside an aluminum bag, along with a humidity indicator card.
b. Bags are labeled and securely packed.
7
Sheet No.: D1-A01801EN
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PT100MF1MP | 制造商:未知厂家 制造商全称:未知厂家 功能描述:PHOTOTRANSISTOR |
| PT100MF1MP1 | 功能描述:光电晶体管 Darlington output Ver of PT100MF0MP1 RoHS:否 制造商:OSRAM Opto Semiconductors 最大功率耗散:165 mW 最大暗电流:200 nA 封装 / 箱体:T-1 |
| PT100P01 | 制造商:Seiko Instruments Inc (SII) 功能描述: |
| PT100PG | 制造商:Hammond Manufacturing 功能描述: |
| PT100PSIG-13-LI3-H1131 | 制造商:TURCK Inc 功能描述:Sensor, Pressure Transmitter, Scaled In Bar, 0-100 bar (0-1450 psi), H6831459 |
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