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| 型号： | PT481FE0000F |
| 厂商： | Sharp Microelectronics |
| 文件页数： | 6/9页 |
| 文件大小： | 0K |
| 描述： | PHOTO TRANS BLACK LEN 860NM SIDE |
| 标准包装： | 1,000 |
| 系列： | * |
| 电压 - 集电极发射极击穿（最大）： | 35V |
| 电流 - 集电极 (Ic)（最大）： | 50mA |
| 电流 - 暗 (Id)（最大）： | 1mA |
| 波长： | 860nm |
| 视角： | 70° |
| 功率 - 最大： | 75mW |
| 安装类型： | 通孔 |
| 方向： | 侧视图 |
| 封装/外壳： | 径向 |
| 其它名称： | 425-2383-5 |
PT481FE0000F
■ Design Notes
1. This product is not designed to resist electromagnetic and ionized-particle radiation.
■ Manufacturing Guidelines
● Soldering Instructions
1. Sharp does not recommend soldering this part using preheat or solder reflow methods. Leads on this part are
pre-coated with lead-free solder.
2. If hand soldering, use temperatures ≤ 260° for ≤ 5 seconds.
3. When mounting this device, care should be taken to prevent any boundary exfoliation (pad lifting) between the
solder, the pad, and the circuit board.
4. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
Fig. 12 Soldering Area
1.4 mm
Soldera b le
● Cleaning Instructions
1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the
optical characteristics.
2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.
3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning
time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-
tions to confirm the harmlessness of the ultrasonic cleaning methods.
4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.
Sheet No.: D1-A01401EN
6
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