参数资料
型号: R5F5630DCDFC#V0
厂商: Renesas Electronics America
文件页数: 78/165页
文件大小: 0K
描述: MCU RX630 1.5MB FLASH 176LQFP
产品培训模块: RX Compare Match Timer
RX DMAC
标准包装: 1
系列: RX600
核心处理器: RX
芯体尺寸: 32-位
速度: 100MHz
连通性: CAN,EBI/EMI,I²C,LIN,SCI,SPI,USB
外围设备: DMA,LVD,POR,PWM,WDT
输入/输出数: 148
程序存储器容量: 1.5MB(1.5M x 8)
程序存储器类型: 闪存
RAM 容量: 128K x 8
电压 - 电源 (Vcc/Vdd): 2.7 V ~ 3.6 V
数据转换器: A/D 8x10b,21x12b,D/A 2x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 176-LQFP
包装: 托盘
R01DS0060EJ0100 Rev.1.00
Page 2 of 168
Sep 13, 2011
RX630 Group
1. Overview
1.
Overview
1.1
Outline of Specifications
Table 1.1 lists the specifications in outline, and Table 1.2 lists the functions of products.
Table 1.1 shows the outline of maximum specifications, and the number of peripheral module channels differs
depending on the pin number on the package and the on-chip ROM capacity. For details, see Table 1.2, Functions of
Table 1.1
Outline of Specifications (1/5)
Classification
Module/Function
Description
CPU
Maximum operating frequency: 100 MHz
32-bit RX CPU
Minimum instruction execution time: One instruction per state (cycle of the system
clock)
Address space: 4-Gbyte linear
Register set of the CPU
General purpose: Sixteen 32-bit registers
Control: Nine 32-bit registers
Accumulator: One 64-bit register
Basic instructions: 73
Floating-point operation instructions: 8
DSP instructions: 9
Addressing modes: 10
Data arrangement
Instructions: Little endian
Data: Selectable as little endian or big endian
On-chip 32-bit multiplier: 32 × 32 64 bits
On-chip divider: 32 / 32 32 bits
Barrel shifter: 32 bits
FPU
Single precision floating point (32 bits)
Data types and floating-point exceptions in conformance with the IEEE754 standard
Memory
ROM
ROM capacity: 2 Mbytes max.
Two on-board programming modes
Boot mode (The user area is programmable via the SCI and USB.)
User program mode
Parallel programmer mode (for off-board programming)
RAM
RAM capacity: 128 Kbytes
E2 data flash
Data ROM capacity: 32 Kbytes
MCU operating modes
Single-chip mode, on-chip ROM enabled expansion mode, and on-chip ROM disabled
expansion mode (software switching)
Clock
Clock generation circuit
Main clock oscillator, sub-clock oscillator, low-speed/high-speed on-chip oscillator, PLL
frequency synthesizer, and dedicated on-chip oscillator for the IWDT
Main-clock oscillation stop detection
Separate frequency-division and multiplication settings for the system clock (ICLK),
peripheral module clock (PCLK), and external bus clock (BCLK)
The CPU and other bus masters run in synchronization with the system clock (ICLK):
Up to 100 MHz
Peripheral modules run in synchronization with the peripheral module clock (PCLK):
Up to 50 MHz
Devices connected to the external bus run in synchronization with the external bus
clock (BCLK): Up to 50 MHz
Reset
Pin reset, power-on reset, voltage-monitoring reset, independent watchdog timer reset,
watchdog timer reset, deep software standby reset, and software reset
Voltage detection circuit
When the voltage on VCC passes the voltage detection level (Vdet), an internal reset or
internal interrupt is generated.
Low power
consumption
Low power
consumption facilities
Module stop function
Four low power consumption modes
Sleep mode, all-module clock stop mode, software standby mode, and deep software
standby mode
Battery backup function
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